Nanoscale soldering of positioned carbon nanotubes using highly conductive electron beam induced gold deposition

Proceedings of the IEEE Conference on Nanotechnology

Volumn 1, Issue , 2003, Pages 335-338

  Madsen, D N ^a   Molhave K ^a   Mateiu, R ^a   Boggild P ^a   Rasmussen, A M ^b   Appel, C C ^b   Brorson, M ^b   Jacobsen, C J H ^b  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

^b HALDOR TOPSØE A S   (Denmark)

Author keywords

Bridges; Carbon nanotubes; Conductivity; Electrodes; Electron beams; Gold; Microelectrodes; Scanning electron microscopy; Soldering; Transmission electron microscopy

Indexed keywords

BRIDGES; CARBON NANOTUBES; DEPOSITION; ELECTRIC CONDUCTIVITY; ELECTRODES; ELECTRON BEAMS; ELECTRON MICROSCOPY; ELECTRONS; GOLD; GOLD DEPOSITS; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; MICROELECTRODES; NANOTECHNOLOGY; NANOTUBES; OHMIC CONTACTS; SCANNING ELECTRON MICROSCOPY; SOLDERING; TRANSMISSION ELECTRON MICROSCOPY; YARN;

CONDUCTIVE ELECTRONS; ELECTRON BEAM-ASSISTED DEPOSITIONS; ENVIRONMENTAL SCANNING ELECTRON MICROSCOPES; GOLD DEPOSITION; GOLD NANOPARTICLES; OHMIC RESISTANCE; ORGANIC PRECURSOR; SOLDERING PROCESS;

MULTIWALLED CARBON NANOTUBES (MWCN);

EID: 84906317763     PISSN: 19449399     EISSN: 19449380     Source Type: Conference Proceeding    
DOI: 10.1109/NANO.2003.1231786     Document Type: Conference Paper

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