Novel silicone-phenyl contained amine curing agent for epoxy resin: 1. Non-isothermal cure and thermal decomposition

Thermochimica Acta

Volumn 593, Issue , 2014, Pages 30-36

  Cao, Jun ^a   Hu, Jijiang ^a   Fan, Hong ^a   Wan, Jintao ^b   Li, Bogeng ^a  

^a ZHEJIANG UNIVERSITY   (China)

^b IMDEA MATERIALS INSTITUTE   (Spain)

Author keywords

Isoconversional kinetics; Non isothermal curing reaction; Silicone phenyl contained polyamine

Indexed keywords

DIFFERENTIAL SCANNING CALORIMETRY; EPOXY RESINS; ISOTHERMS; REACTION KINETICS; SILICONES; THERMOGRAVIMETRIC ANALYSIS;

BISPHENOL A EPOXY RESIN; CURING KINETICS; EFFECTIVE ACTIVATION ENERGY; EXOTHERMIC PEAK TEMPERATURE; ISOCONVERSIONAL KINETICS; NON-ISOTHERMAL CURING REACTIONS; POLYAMINES; THERMALLY STABLE; AMINE CURING; NONISOTHERMAL;

CURING;

EID: 84904744736     PISSN: 00406031     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tca.2014.06.014     Document Type: Article

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