Kinetics study of thermal decomposition of electronic packaging material

Chemical Engineering Journal

Volumn 98, Issue 1-2, 2004, Pages 39-51

  Liou, Tzong Horng ^a  

^a HSIUPING INSTITUTE OF TECHNOLOGY   (Taiwan)

Author keywords

Electronic packaging material; Kinetics; Mechanism; Silica; Thermal decomposition

Indexed keywords

ELECTRONICS PACKAGING; FILLERS; GRAIN SIZE AND SHAPE; HEATING; HIGH TEMPERATURE EFFECTS; MOLDING; OXIDATION; OXYGEN; PYROLYSIS; SEMICONDUCTOR DEVICES; SILICA; THERMOGRAVIMETRIC ANALYSIS;

HEATING RATE; INORGANIC FILLERS;

REACTION KINETICS;

KINETICS;

EID: 1542468247     PISSN: 13858947     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1385-8947(03)00181-5     Document Type: Article

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