Cure kinetics of an epoxy resin containing naphthyl/ dicyclopentadiene moieties and bis-phenoxy (3-hydroxy) phosphine oxide system and properties of its cured polymer

Journal of Applied Polymer Science

Volumn 112, Issue 2, 2009, Pages 761-768

  Ren, Hua ^a,b   Sun, Jianzhong ^a   Zhao, Qian ^a   Zhiqi, Cai ^a   Ling, Qincai ^a   Zhou, Qiyun ^a  

^a ZHEJIANG UNIVERSITY   (China)

^b NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

Bisphenoxy (3 hydroxy) phosphine oxide; Cure kinetics; Epoxy resin

Indexed keywords

ADVANCED ISOCONVERSIONAL METHODS; AUTOCATALYTIC; BISPHENOXY (3-HYDROXY) PHOSPHINE OXIDE; CROSSLINKED NETWORK STRUCTURES; CURE KINETICS; CURING REACTIONS; CURING SYSTEMS; DICYCLOPENTADIENE; DIFFUSION FACTORS; DYNAMIC MECHANICAL THERMAL ANALYSIS; EFFECTIVE ACTIVATION ENERGIES; FLAME RETARDANCY; GLASS TRANSITION TEMPERATURES; ISOTHERMAL CONDITIONS; ISOTHERMAL DSC; KISSINGER MODELS; LIMITING OXYGEN INDICES; MOLECULAR MOBILITIES; NON ISOTHERMALS; NON-ISOTHERMAL DSC; THERMAL STABILITIES;

ACTIVATION ENERGY; CURING; DIFFERENTIAL SCANNING CALORIMETRY; GLASS TRANSITION; OXYGEN; PHENOXY RESINS; PHOSPHORUS COMPOUNDS; POLYMER BLENDS; RESINS; THERMOANALYSIS;

EPOXY RESINS;

CROSS LINKING; CURING (CHEMISTRY); DIFFUSION; EPOXY RESIN; FLAME RESISTANCE; GLASS TRANSITION TEMPERATURE; POLYMER PROPERTY; THERMAL ANALYSIS; THERMOGRAVIMETRY;

EID: 64249162423     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.29491     Document Type: Article

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