-
1
-
-
84856481677
-
Evolution, challenge, and outlook of TSV, 3D IC integration and 3D silicon integration
-
China)
-
Lau J H, Evolution, challenge, and outlook of TSV, 3D IC integration and 3D silicon integration, APM 11 (International Symposium on Advanced Packaging Materials, China) 2011, 462-488.
-
(2011)
APM 11 (International Symposium On Advanced Packaging Materials
, pp. 462-488
-
-
Lau, J.H.1
-
2
-
-
79955674949
-
Fifty years of Moore's law
-
Mack C A, Fifty years of Moore's law, IEEE T Semiconduct M, 24 (2011) 202-207.
-
(2011)
IEEE T Semiconduct M
, vol.24
, pp. 202-207
-
-
Mack, C.A.1
-
4
-
-
32044460599
-
From theory to practice: Challenges in operationalising a technology selection framework
-
Shehabuddeen N, Probert D & Phaal R, From theory to practice: challenges in operationalising a technology selection framework, Technovation, 26 (2006) 324-335.
-
(2006)
Technovation
, vol.26
, pp. 324-335
-
-
Shehabuddeen, N.1
Probert, D.2
Phaal, R.3
-
5
-
-
0037062541
-
The contribution of technology selection to core competencies
-
Torkkeli M & Tuominen M, The contribution of technology selection to core competencies, Int J Prod Econ, 77 (2002) 271-284.
-
(2002)
Int J Prod Econ
, vol.77
, pp. 271-284
-
-
Torkkeli, M.1
Tuominen, M.2
-
6
-
-
70349606080
-
The application of Fuzzy Delphi Method and Fuzzy AHP in lubricant regenerative technology selection
-
Hsu Y L, Lee C H & Kreng V B, The application of Fuzzy Delphi Method and Fuzzy AHP in lubricant regenerative technology selection, Expert Syst Appl, 37 (2010) 419-425.
-
(2010)
Expert Syst Appl
, vol.37
, pp. 419-425
-
-
Hsu, Y.L.1
Lee, C.H.2
Kreng, V.B.3
-
8
-
-
79951902080
-
Critical issues of TSV and 3D IC integration
-
Lau J H, Critical issues of TSV and 3D IC integration, J Microelectronics Electronic Packaging, 7 (2010) 35-43.
-
(2010)
J Microelectronics Electronic Packaging
, vol.7
, pp. 35-43
-
-
Lau, J.H.1
-
9
-
-
79951910180
-
3D IC Integration with TSV Interposers for High-Performance Applications
-
Lau J H, Chan Y & Lee R, 3D IC Integration with TSV Interposers for High-Performance Applications, Chip Scale Review, 14 (2010) 26-29.
-
(2010)
Chip Scale Review
, vol.14
, pp. 26-29
-
-
Lau, J.H.1
Chan, Y.2
Lee, R.3
-
10
-
-
55949111007
-
A taxonomic review of methods and tools applied in technology assessment
-
Tran T A & Daim T, A taxonomic review of methods and tools applied in technology assessment, Technol Forecast Soc Change, 75 (2008) 1396-1405.
-
(2008)
Technol Forecast Soc Change
, vol.75
, pp. 1396-1405
-
-
Tran, T.A.1
Daim, T.2
-
11
-
-
71849101225
-
A hybrid selection model for emerging technology
-
Shen Y C, Chang S H, Lin G T R & Yu H C, A hybrid selection model for emerging technology, Technol Forecast Soc Change, 77 (2010) 151-166.
-
(2010)
Technol Forecast Soc Change
, vol.77
, pp. 151-166
-
-
Shen, Y.C.1
Chang, S.H.2
Lin, G.T.R.3
Yu, H.C.4
-
13
-
-
10844287885
-
An R&D options selection model for investment decisions
-
Coldrick S, Longhurst P, Ivey P & Hannis J, An R&D options selection model for investment decisions, Technovation, 25 (2005) 185-193.
-
(2005)
Technovation
, vol.25
, pp. 185-193
-
-
Coldrick, S.1
Longhurst, P.2
Ivey, P.3
Hannis, J.4
-
14
-
-
41049110990
-
A fuzzy AHP application in government-sponsored R&D project selection
-
Huang C C, Chu P Y & Chiang Y H, A fuzzy AHP application in government-sponsored R&D project selection, Omega, 36 (2008) 1038-1052.
-
(2008)
Omega
, vol.36
, pp. 1038-1052
-
-
Huang, C.C.1
Chu, P.Y.2
Chiang, Y.H.3
-
15
-
-
0001083751
-
The Max-Min Delphi method and fuzzy Delphi method via fuzzy integration
-
Ishikawa A, Amagasa M, Shiga T, Tomizawa G, Tatsuta R & Mieno H, The Max-Min Delphi method and fuzzy Delphi method via fuzzy integration, Fuzzy Sets Syst, 55 (1993) 241-253.
-
(1993)
Fuzzy Sets Syst
, vol.55
, pp. 241-253
-
-
Ishikawa, A.1
Amagasa, M.2
Shiga, T.3
Tomizawa, G.4
Tatsuta, R.5
Mieno, H.6
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