Bonding bare die LEDs on PET foils for lighting applications: Thermal design modeling and bonding experiments

2012 4th Electronic System-Integration Technology Conference, ESTC 2012

Volumn , Issue , 2012, Pages

  Van Den Ende, D A ^a   Kusters, R H L ^a   Cauwe, M ^b   Van Der Waal, A ^c   Van Den Brand, J ^a  

^a HOLST CENTRE   (Netherlands)

^b IMEC   (Belgium)

^c TNO   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; DESIGN; ELECTRONICS ENGINEERING; INFRARED IMAGING; INTEGRATION; LIGHTING; SUBSTRATES; TEMPERATURE DISTRIBUTION;

ANISOTROPIC CONDUCTING ADHESIVES; EXPERIMENTAL COMPARISON; INFRARED THERMAL IMAGING; LIGHTING APPLICATIONS; LOW-TEMPERATURE STABILITY; MANUFACTURING PROCESS; MAXIMUM TEMPERATURE; THERMAL DESIGN MODELS;

LIGHT EMITTING DIODES;

EID: 84902440882     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2012.6542119     Document Type: Conference Paper

References (8)

1. J. van den Brand et al. "Systems-in-foil - Devices, fabrication processes and reliability issues" Microelectron. Reliability 48 (2008) pp. 1123-1128.
2. Mukish et al., LED Cost and Technology Trends: How to enable massive adoption in general lighting, LED Forum Lyon - December 7th 2011
3. th Electronics Packaging Technology Conference, Singapore, dec. 2009 pp. 926-929
4. th edition, BR Publishing Inc (Seaside, 2011) pp. 146-147
5. th European Microelectronics and Packaging Conf. Brighton, UK, Sept. 2011. art. 6142415
6. th edition, BR Publishing Inc (Seaside, 2011) pp. 149
7. th edition, John Wiley & Sons (2002), Chapter 9.
8. nd Electronic Components and Technology Conf, San Diego, CA, May. 2012, pp 238-245.