Optimization of flexible substrate for automotive LED rear-lamp

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2009, Pages 926-929

  Kim, Young Woo ^a   Kim, Min Sung ^a   Park, Sung Mo ^a   Kim, Jae Pil ^a   Song, Sang Bin ^a   Whang, Nam ^a   Lim, Yeong Seog ^b  

^a Korea Photonics Technology Institute (KOPTI)   (South Korea)

^b Chonnam National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AMBIENT TEMPERATURES; CFD (COMPUTATIONAL FLUID DYNAMICS); COPPER FOILS; COPPER LAYER; EXTERIOR LIGHTING; FLEXIBLE SUBSTRATE; FORWARD CURRENTS; FORWARD VOLTAGE; HEAT EMISSION; HEAT SPREADERS; HIGH BRIGHTNESS; LIGHT OUTPUT; THERMAL RESISTANCE; TOP SURFACE;

COMPUTATIONAL FLUID DYNAMICS; HEATING EQUIPMENT; LEAKAGE (FLUID); LIGHT EMITTING DIODES; LIGHTING; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT DESIGN; PRINTED CIRCUIT MANUFACTURE; SPREADERS; SUBSTRATES;

CHIP SCALE PACKAGES;

EID: 77950938441     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2009.5416410     Document Type: Conference Paper

References (8)

1. Bielecki, J. et al, "Thermal Considerations for LED Components in an Automotive Lamp," SEMI-THERM 2007, San Jose, CA, USA, Mar. 2007, pp. 37-43.
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4. Chen, C. H. et al, "Thermal Management and Novel Package Design of High Power Light-Emitting Diodes," Orlando, FL, USA, 58th ECTC, May. 2008, pp. 795-797.
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8. Optronic Laboratories, Inc., OL 770 User's reference, Optronic Laboratories, Inc., Orlando, 2007.