Developing process for coating copper particles with silver by electroless plating method

Surface and Coatings Technology

Volumn 201, Issue 6, 2006, Pages 3788-3792

  Hai, H T ^a,b   Ahn, J G ^a   Kim, D J ^a   Lee, J R ^a   Chung, H S ^a   Kim, C O ^b  

^a Korea Institute of Geosceince and Mineral Resources   (South Korea)

^b Chungnam National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

HYDROLYSIS; METALLIC MATRIX COMPOSITES; POWDER COATINGS; PROTECTIVE COATINGS; SILVER;

SILVER COATING; SILVER-COPPER COMPOSITE POWDERS;

ELECTROLESS PLATING;

ELECTROLESS PLATING; HYDROLYSIS; METALLIC MATRIX COMPOSITES; POWDER COATINGS; PROTECTIVE COATINGS; SILVER;

EID: 33751002342     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2006.03.025     Document Type: Article

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