Fabrication and performance of silver coated copper powder

Electronic Materials Letters

Volumn 8, Issue 4, 2012, Pages 467-470

  Cao, Xiao Guo ^a   Zhang, Hai Yan ^a  

^a GUANGDONG UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

chelating reagent; copper powder; electroless; oxidation resistance; sliver coating

Indexed keywords

ACETYLACETONE; CHELATING COMPOUND; CHELATING REAGENT; COPPER PARTICLES; DISPLACEMENT REACTIONS; ELECTROLESS; FABRICATION PARAMETERS; GRAVIMETRIC METHODS; MOLAR RATIO; SILVER COATINGS; SILVER CONTENT; SILVER LAYER; SILVER PARTICLES; SUBSTITUTION PLATING; X-RAY ENERGY DISPERSIVE SPECTROSCOPY;

ACETONE; CHELATION; COATINGS; COPPER; COPPER POWDER; ENERGY DISPERSIVE SPECTROSCOPY; FABRICATION; OXIDATION RESISTANCE; SCANNING ELECTRON MICROSCOPY; SILVER PLATING; SUBSTITUTION REACTIONS; X RAY DIFFRACTION;

SILVER;

EID: 84865828283     PISSN: 17388090     EISSN: 20936788     Source Type: Journal    
DOI: 10.1007/s13391-012-1110-6     Document Type: Article

References (15)

1. Y. K. Hong, C. Y. Lee, C. K. Jeong, J. H. Sim, K. Kim, J. Joo, M. S. Kim, J. Y. Lee, S. H. Jeong, and S. W. Byun, Curr. Appl. Phys. 1, 439 (2001).
2. M. T. Kortschot and R. T. Woodhams, Polym. Compos. 6, 296 (1985).
3. Y. P. Mamunya, V. V. Davydenko, P. Pissis, and E. Lebedev, Eur. Polym. J. 38, 1887 (2002).
4. G. Jiang, M. Gilbert, D. J. Hitt, G. D. Wilcox, and K. Balasubramanian, Compos. Part a-Appl. Sci. Manuf. 33, 745 (2002).
5. I. Novak, I. Krupa, and I. Chodak, Synthetic Met. 144, 13 (2004).
6. K. S. Park, J. T. Son, H. T. Chung, S. J. Kim, C. H. Lee, K. T. Kang, and H. G. Kim, Solid State Commun. 129, 311 (2004).
7. Y. Q. Xue, B. J. Gao, and J. F. Gao, J. Colloid Interf. Sci. 191, 81 (1997).
8. Q. H. Lu and H. Keizou, Funct. Mate. 29, 439 (1998).
9. J. Li, X. J. Pan, S. D. You, and S. X. Huang, US Patent No. 5, 372, 749 (1994).
10. X. R. Xu, X. J. Luo, H. R. Zhuang, W. L. Li, and B. L. Zhang, Mater. Lett. 57, 3987 (2003).
11. B. J. Gao, J. F. Gao, H. M. Jiang, and Z. X. Zhang, Acta Phys.-Chim. Sin. 16, 366 (2000).
12. K. Noriaki, Y. Joei, and M. Takeo, US Patent No. 4, 652, 465 (1987).
13. T. Hayashi, US Patent No. 5, 178, 909 (1993).
14. B. J. Gao, H. M. Jiang, and Z. X. Zhang, Chin. J. Inorg. Chem. 16, 669 (2000).
15. Z. Q. Zhang, Anal. Chem., p. 519, Science Press, Beijing (2001).