Laser curing of silver-based conductive inks for in situ 3D structural electronics fabrication in stereolithography

Journal of Materials Processing Technology

Volumn 214, Issue 9, 2014, Pages 1935-1945

  Lopes, Amit J ^a   Lee, In Hwan ^b   Macdonald, Eric ^a   Quintana, Rolando ^c   Wicker, Ryan ^a  

^a 500 W University Avenue   (United States)

^b Chungbuk National University   (South Korea)

^c UNIVERSITY OF TEXAS AT SAN ANTONIO   (United States)

Author keywords

3D structural electronics; Additive manufacturing; Direct print; In situ laser curing; Multiple materials

Indexed keywords

3D PRINTERS; ELECTRONICS INDUSTRY; FABRICATION; LASER BEAMS; MACHINE DESIGN; MASKS; OVENS; PRINTED CIRCUIT BOARDS; PRINTING MACHINERY; SILVER; STATISTICS; STEREOLITHOGRAPHY; SUBSTRATES;

APPLICATION REQUIREMENTS; CONSTRAINED MECHANICAL SYSTEMS; DIRECT PRINT; ELECTRONICS FABRICATION; LASER CURING; MINIMIZING THE NUMBER OF; MULTIPLE MATERIALS; PRINTED CIRCUIT BOARD (PCBS);

CURING;

EID: 84900391350     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2014.04.009     Document Type: Article

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