Realizing 3-D interconnected direct write electronics within smart stereolithography structures

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Volumn 5, Issue , 2005, Pages 287-293

  Palmer, Jeremy A ^a   Summers, Jeffrey L ^b   Davis, Donald W ^a   Gallegos, Phillip L ^a   Chavez, Bart D ^a   Yang, Pin ^a   Medina, Francisco ^c   Wicker, Ryan B ^c  

^a SANDIA NATIONAL LABORATORIES   (United States)

^b MicroSat Systems Inc   (United States)

^c UNIVERSITY OF TEXAS AT EL PASO   (United States)

Author keywords

Direct Write; Interconnect; Stereolithography

Indexed keywords

DIRECT WRITE; INTERCONNECTS; STEREOLITHOGRAPHY (SL);

ELECTRONICS PACKAGING; RESINS; ROBUSTNESS (CONTROL SYSTEMS); SIGNAL INTERFERENCE;

ELECTRONIC EQUIPMENT;

EID: 33645054048     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2005-79360     Document Type: Conference Paper

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