Ohmic curing of printed silver conductive traces

Journal of Electronic Materials

Volumn 41, Issue 9, 2012, Pages 2553-2566

  Roberson, D A ^a   Wicker, R B ^a   MacDonald, E ^a  

^a 500 W University Avenue   (United States)

Author keywords

Conductive ink; direct print; inkjet; nanoparticle silver; polyimide; scanning electron microscopy

Indexed keywords

CONDUCTIVE INK; CURING CYCLE; CURING METHODS; CURING PROCESS; DIRECT PRINT; ELECTRICAL CHARACTERIZATION; ELECTRICAL CURRENT; INKJET; MICRO PARTICLES; MICROSTRUCTURAL CHANGES; NANO-PARTICLE SILVER; PARTICLE SINTERING; PREPROCESS; REAL TIME; SUBSTRATE MATERIAL; TEMPERATURE LIMITATION; THERMAL CURING; TRACE LENGTH;

CURING; DIAMOND CUTTING TOOLS; EXPERIMENTS; GRAIN GROWTH; NANOPARTICLES; POLYIMIDES; PRINTING MACHINERY; SCANNING ELECTRON MICROSCOPY; SINTERING;

SILVER;

EID: 84865206318     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-012-2140-4     Document Type: Article

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