Integrating stereolithography and direct print technologies for 3D structural electronics fabrication

Rapid Prototyping Journal

Volumn 18, Issue 2, 2012, Pages 129-143

  Lopes, Amit Joe ^a   MacDonald, Eric ^a   Wicker, Ryan B ^a  

^a University of Texas at El Paso   (United States)

Author keywords

3D structural electronics; Direct write; Integrated additive manufacturing; Manufacturing systems; Multiple materials; Rapid prototypes

Indexed keywords

3-D PACKAGES; 3D CIRCUIT; 3D STRUCTURE; 3D SYSTEMS; ADDITIVE MANUFACTURING; ADVANCED APPLICATIONS; CONDUCTIVE INK; DESIGN/METHODOLOGY/APPROACH; DIRECT PRINT; DIRECT WRITE; ELECTRONIC DEVICE; ELECTRONIC SYSTEMS; ELECTRONICS FABRICATION; EMBEDDED ELECTRONIC SYSTEMS; EMBEDDED ELECTRONICS; HYBRID MANUFACTURING SYSTEMS; INTEGRATED ADDITIVE MANUFACTURING; INTEGRATED MANUFACTURING; LASER CURING; LINEAR TRANSLATION; MANUFACTURING FLEXIBILITY; MANUFACTURING PROCESS; MICRO-DISPENSING; MONOLITHIC STRUCTURES; MULTIPLE LAYERS; MULTIPLE MATERIALS; NON-TRADITIONAL; PART DESIGN; PASSIVE ELECTRONIC COMPONENTS; POST PROCESSING; RAPID PROTOTYPE; RESEARCH AND DEVELOPMENT; RESEARCH LIMITATIONS; SEMI-AUTOMATED; SINGLE LAYER; THREE DIMENSIONAL (3D) STRUCTURES; TIMER CIRCUITS; UNCURED RESINS;

ELECTRONIC STRUCTURE; ELECTRONICS ENGINEERING; EMBEDDED SYSTEMS; FABRICATION; FLEXIBLE MANUFACTURING SYSTEMS; HYBRID MATERIALS; INDUSTRIAL ENGINEERING; INTEGRATED CIRCUIT MANUFACTURE; INTEGRATION; MANUFACTURE; OPTIMIZATION; PRINTING MACHINERY; PRODUCTION ENGINEERING; SUBSTRATES; TECHNOLOGY;

THREE DIMENSIONAL;

EID: 84858047041     PISSN: 13552546     EISSN: None     Source Type: Journal    
DOI: 10.1108/13552541211212113     Document Type: Article

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