Patterned electrochemical deposition of copper using an electron beam

APL Materials

Volumn 2, Issue 2, 2014, Pages

  Den Heijer, Mark ^a   Shao, Ingrid ^b   Radisic, Alex ^c   Reuter, Mark C ^b   Ross, Frances M ^b  

^a LEIDEN UNIVERSITY   (Netherlands)

^b IBM T J WATSON RESEARCH CENTER   (United States)

^c IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84900005620     PISSN: None     EISSN: 2166532X     Source Type: Journal    
DOI: 10.1063/1.4863596     Document Type: Article

References (38)

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