Microstructural studies of W-10 wt.% Cu composites prepared by using ultrafine composite powder

International Journal of Refractory Metals and Hard Materials

Volumn 45, Issue , 2014, Pages 76-79

  Sun, Benzhe ^a   Song, Jiupeng ^b   Yu, Yang ^b   Zhuang, Zhigang ^b   Niu, Mingjie ^a   Liu, Yan ^a   Zhang, Tinghui ^a   Qi, Yang ^a  

^a NORTHEASTERN UNIVERSITY   (China)

^b XIAMEN TUNGSTEN CO LTD   (China)

Author keywords

Grain size; Orientation relationship; Residual stress; Tungsten copper composites; Ultrafine composite powder

Indexed keywords

GRAIN SIZE AND SHAPE; RESIDUAL STRESSES; SINTERING; TUNGSTEN ALLOYS; TUNGSTEN COMPOUNDS;

COMPOSITE POWDERS; CONSTITUENT PHASIS; GRAIN SIZE; INTERPLANAR SPACINGS; MICRO-STRUCTURAL; NANOSCALE RANGES; ORIENTATION RELATIONSHIP; TUNGSTEN-COPPER COMPOSITES;

NANOCOMPOSITES;

EID: 84899634829     PISSN: 02634368     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijrmhm.2014.04.005     Document Type: Article

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