메뉴 건너뛰기




Volumn 29, Issue 4, 2011, Pages 538-541

Tungsten-copper composite production by activated sintering and infiltration

Author keywords

Activated sintering; Infiltration; Tungsten copper composites

Indexed keywords

ACTIVATED SINTERING; INTERCONNECTED POROSITY; PRODUCTION PARAMETERS; SINTERING TEMPERATURES; TUNGSTEN-COPPER COMPOSITES; W-CU COMPOSITES;

EID: 79955534339     PISSN: 02634368     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijrmhm.2011.03.009     Document Type: Article
Times cited : (134)

References (15)
  • 1
    • 33646161919 scopus 로고    scopus 로고
    • Evaluation of conductivity in W-Cu composites through the estimation of topological microstructures
    • Y.J. Lee, B.H. Leeb, G.S. Kim, D.G. Kim, D.S. Kim, and Y.D. Kim Evaluation of conductivity in W-Cu composites through the estimation of topological microstructures Mater Lett 60 2006 2000 2003
    • (2006) Mater Lett , vol.60 , pp. 2000-2003
    • Lee, Y.J.1    Leeb, B.H.2    Kim, G.S.3    Kim, D.G.4    Kim, D.S.5    Kim, Y.D.6
  • 2
    • 33646123752 scopus 로고    scopus 로고
    • Arc erosion behavior of a nanocomposite W-Cu electrical contact material
    • G. Wengel, K. Zhanying, S. Hongfang, and D. Bingjun Arc erosion behavior of a nanocomposite W-Cu electrical contact material Rare Met 25 2006 37 42
    • (2006) Rare Met , vol.25 , pp. 37-42
    • Wengel, G.1    Zhanying, K.2    Hongfang, S.3    Bingjun, D.4
  • 3
    • 0035876849 scopus 로고    scopus 로고
    • Effect of TiC in copper-tungsten electrodes on EDM performance
    • DOI 10.1016/S0924-0136(01)00622-7, PII S0924013601006227
    • L. Li, Y.S. Wong•, J.Y.H. Fuh, and L. Lu Effect of TiC in copper-tungsten electrodes on EDM performance J Mater Proc Tech 113 2001 563 567 (Pubitemid 32518424)
    • (2001) Journal of Materials Processing Technology , vol.113 , Issue.1-3 , pp. 563-567
    • Li, L.1    Wong, Y.S.2    Fuh, J.Y.H.3    Lu, L.4
  • 7
    • 34247162392 scopus 로고    scopus 로고
    • Thin intergranular films and solid-state activated sintering in nickel-doped tungsten
    • DOI 10.1016/j.actamat.2007.01.017, PII S1359645407000705
    • V.K. Gupta, D.H. Yoon, H.M. Meyer, and J. Luo Thin intergranular films and solid-state activated sintering in nickel-doped tungsten Acta Mater 55 2007 3131 3142 (Pubitemid 46603060)
    • (2007) Acta Materialia , vol.55 , Issue.9 , pp. 3131-3142
    • Gupta, V.K.1    Yoon, D.-H.2    Meyer III, H.M.3    Luo, J.4
  • 8
    • 28444470814 scopus 로고    scopus 로고
    • Segregation-induced grain boundary premelting in nickel-doped tungsten
    • J. Luo, V.K. Gupta, and D.H. Yoon Segregation-induced grain boundary premelting in nickel-doped tungsten Appl Phys Lett 87 2005 231902
    • (2005) Appl Phys Lett , vol.87 , pp. 231902
    • Luo, J.1    Gupta, V.K.2    Yoon, D.H.3
  • 12
    • 0021531810 scopus 로고
    • Grain boundary segregation of Ni in W
    • G. Nieh Grain boundary segregation of Ni in W Scr Mater 18 1981 1279 1282
    • (1981) Scr Mater , vol.18 , pp. 1279-1282
    • Nieh, G.1
  • 13
    • 0042027952 scopus 로고    scopus 로고
    • High temperature compressive deformation and fracture characteristics of the activated sintered W-Ni compacts
    • S.W. Kim, S.I. Lee, Y.D. Kim, and I.H. Moon High temperature compressive deformation and fracture characteristics of the activated sintered W-Ni compacts Inte J Refract Met Hard Mater 21 2003 183 192
    • (2003) Inte J Refract Met Hard Mater , vol.21 , pp. 183-192
    • Kim, S.W.1    Lee, S.I.2    Kim, Y.D.3    Moon, I.H.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.