Electrodeposition and characterization of nickel-copper metallic foams for application as electrodes for supercapacitors

Journal of Applied Electrochemistry

Volumn 44, Issue 4, 2014, Pages 455-465

  Eugenio S ^a   Silva, T M ^a,b   Carmezim, M J ^a,c   Duarte, R G ^a,c   Montemor, M F ^a  

^a INSTITUTO SUPERIOR TÉCNICO   (Portugal)

^b INSTITUTO SUPERIOR DE ENGENHARIA DE LISBOA   (Portugal)

^c INSTITUTO POLITÉCNICO DE SETÚBAL   (Portugal)

Author keywords

Electrodeposition; Electrodes for supercapacitors; Nanostructured foams; Nickel copper

Indexed keywords

BINARY ALLOYS; CAPACITANCE; COPPER ALLOYS; COPPER DEPOSITS; COPPER METALLOGRAPHY; CYCLIC VOLTAMMETRY; ELECTRIC DISCHARGES; ELECTROCHEMICAL ELECTRODES; ELECTRODEPOSITION; ELECTROLYTES; METAL FOAMS; MORPHOLOGY; NANOCRYSTALLINE MATERIALS; NICKEL; NICKEL DEPOSITS; NICKEL METALLOGRAPHY; SCANNING ELECTRON MICROSCOPY; SUPERCAPACITOR;

CAPACITANCE RETENTION; CHARGE DISCHARGE CURVES; CHEMICAL COMPOSITIONS; DENDRITIC STRUCTURES; DEPOSITION PARAMETERS; ELECTROCHEMICAL BEHAVIOUR; NANO-STRUCTURED; SPECIFIC CAPACITANCE;

COPPER NICKEL DEPOSITS;

EID: 84899462212     PISSN: 0021891X     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10800-013-0646-y     Document Type: Conference Paper

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