Effects of (NH4)2SO4 and BTA on the nanostructure of copper foam prepared by electrodeposition

Electrochimica Acta

Volumn 56, Issue 25, 2011, Pages 9397-9405

  Nam, Dohwan ^a   Kim, Ryounghee ^a   Han, Dongwook ^a   Kim, Jeonghan ^a   Kwon, Hyuksang ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Chemical additive; Copper foam; Electrodeposition; Hydrogen evolution; Mechanical property; Porous structure

Indexed keywords

BENZOTRIAZOLES; CATHODIC CURRENT DENSITY; CHEMICAL ADDITIVE; COMPRESSION TESTS; COPPER DEPOSITION; COPPER FOAM; DYNAMIC TEMPLATES; ELECTRODEPOSITION PROCESS; ELECTROLYTIC BATHS; HYDROGEN BUBBLES; HYDROGEN EVOLUTION; HYDROGEN GAS EVOLUTION; NANODENDRITES; NEEDLE-LIKE; POROUS STRUCTURES; REACTION MECHANISM; STRUCTURAL CHARACTERISTICS;

ADDITIVES; COMPRESSION TESTING; COPPER; DEPOSITS; ELECTRODEPOSITION; HYDROGEN; MECHANICAL PROPERTIES; MORPHOLOGY; NANOSTRUCTURES; NEEDLES; SCANNING ELECTRON MICROSCOPY; STIFFNESS; TRANSMISSION ELECTRON MICROSCOPY;

COPPER DEPOSITS;

EID: 80053282642     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2011.08.025     Document Type: Article

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