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Thin Solid Films

Volumn 518, Issue 18, 2010, Pages 5159-5163

Effect of bromide ions and polyethylene glycol on morphological control of electrodeposited copper foam

(3) Tan, Kai a Tian, Min Bo a Cai, Qiang a

a TSINGHUA UNIVERSITY (China)

Author keywords

3 dimensional; Copper foam; Electrodeposition; Hydrogen evolution; Porous

Indexed keywords

3-DIMENSIONAL; BROMIDE IONS; COPPER ELECTRODEPOSITION; COPPER FOAM; ELECTRODEPOSITED COPPER; HIGH CURRENT DENSITIES; HYDROGEN EVOLUTION; MORPHOLOGICAL CONTROL; POLYETHYLENE GLYCOLS (PEG); POROUS; SURFACE PORES; SYNERGETIC EFFECT; WALL STRUCTURE;

BIOLOGY; BROMINE COMPOUNDS; COPPER; ELECTRODEPOSITION; HYDROGEN; IONS; MICROSTRUCTURE; MORPHOLOGY; POLYETHYLENE GLYCOLS; POLYETHYLENE OXIDES; POLYETHYLENES; THERMOPLASTICS;

FOAM CONTROL;

EID: 77955662946 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/j.tsf.2010.03.029 Document Type: Article

Times cited : (30)

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