-
1
-
-
0031706383
-
Extraction of parasitics within wire-bond IGBT modules
-
K. Xing, F. C. Lee, and D. Boroyevich, "Extraction of parasitics within wire-bond IGBT modules," in Proc. IEEE Appl. Power Electron. Conf. Expo., 1994, pp. 497-503.
-
(1994)
Proc. IEEE Appl. Power Electron. Conf. Expo.
, pp. 497-503
-
-
Xing, K.1
Lee, F.C.2
Boroyevich, D.3
-
2
-
-
0034448374
-
Analysis on the low current turn-on behavior of IGBT module
-
S. Momota, M. Otsuki, K. Ishii, H. Takubo, and Y. Seki, "Analysis on the low current turn-on behavior of IGBT module," in Proc. Int. Symp. Power Semicond. Devices ICs, 2000, pp. 359-362. (Pubitemid 32400150)
-
(2000)
IEEE International Symposium on Power Semiconductor Devices and ICs (ISPSD)
, pp. 359-362
-
-
Momota, S.1
Otsuki, M.2
Ishii, K.3
Takubo, H.4
Seki, Y.5
-
3
-
-
0030422451
-
MOSFET switching behavior under influence of PCB stray inductance
-
W. Teulings, J. L. Schanen, and J. Roudet, "MOSFET switching behavior under influence of PCB stray inductance," in Proc. IEEE Ind. Appl. Conf., 1996, pp. 1449-1453.
-
(1996)
Proc.IEEE Ind. Appl. Conf.
, pp. 1449-1453
-
-
Teulings, W.1
Schanen, J.L.2
Roudet, J.3
-
4
-
-
84874866585
-
Evaluation of Vce monitoring as a real-time method to estimate aging of bond wire-IGBT modules stressed by power cycling
-
Jul.
-
V. Smet, F. Forest, J. Huselstein, A. Rashed, and F. Richardeau, "Evaluation of Vce monitoring as a real-time method to estimate aging of bond wire-IGBT modules stressed by power cycling," in IEEE Trans. Ind. Electron., vol. 60, no. 7, pp. 2760-2770, Jul. 2013.
-
(2013)
IEEE Trans. Ind. Electron.
, vol.60
, Issue.7
, pp. 2760-2770
-
-
Smet, V.1
Forest, F.2
Huselstein, J.3
Rashed, A.4
Richardeau, F.5
-
5
-
-
84897693569
-
Dynamic voltage rise control, the most efficient way to control turn-off switching behavior of IGBT transistors
-
P.Luniewski, U. Jansen, and M. Hornkamp, "Dynamic voltage rise control, the most efficient way to control turn-off switching behavior of IGBT transistors," in Proc. Int. Conf. Power Electron. Intell. Control Energy Convers., 2005, vol. 80, pp. 1-6.
-
(2005)
Proc. Int. Conf. Power Electron. Intell. Control Energy Convers.
, vol.80
, pp. 1-6
-
-
Luniewski, P.1
Jansen, U.2
Hornkamp, M.3
-
6
-
-
0037235715
-
Measurement-based characterization method for integrated power electronics modules
-
L. Yang, F. C. Lee, and W. G. Odendaal, "Measurement-based characterization method for integrated power electronics modules," in Proc. IEEE Appl. Power Electron. Conf. Expo., 2003, pp. 490-496.
-
(2003)
Proc.IEEE Appl. Power Electron. Conf. Expo.
, pp. 490-496
-
-
Yang, L.1
Lee, F.C.2
Odendaal, W.G.3
-
7
-
-
0028735628
-
Analysis of an IGBT power module
-
A. Brambilla, E. Dallago, and R. Romano, "Analysis of an IGBT power module," in Proc. Int. Conf. Ind. Electron. Control Instrum., 1994, pp. 129-134.
-
(1994)
Proc. Int. Conf. Ind. Electron. Control Instrum.
, pp. 129-134
-
-
Brambilla, A.1
Dallago, E.2
Romano, R.3
-
8
-
-
83355171628
-
Parasitic considerations of layout design within IGBT module
-
P. Zhang, S.Wen, and Y. Zhong, "Parasitic considerations of layout design within IGBT module," in Proc. Int. Conf. Elelctr.Mach. Syst., 2011, pp. 1-4.
-
(2011)
Proc. Int. Conf. Elelctr.Mach. Syst.
, pp. 1-4
-
-
Zhang, P.1
Wen, S.2
Zhong, Y.3
-
9
-
-
78651349303
-
Parasitic considerations of gate drive for IGBT
-
P. Zhang, S.Wen, J. Liu, and X. Zhuang, "Parasitic considerations of gate drive for IGBT," in Proc. Int. Conf. Elelctr. Mach. Syst., 2010, pp. 1912-1915.
-
(2010)
Proc. Int. Conf. Elelctr. Mach. Syst.
, pp. 1912-1915
-
-
Zhang, P.1
Wen, S.2
Liu, J.3
Zhuang, X.4
-
10
-
-
84870884654
-
A 6.5 kW wirebondless, double-sided cooling power electronics module
-
H. Zhang, S. S. Ang, A. Mantooth, and J. C. Balda, "A 6.5 kW wirebondless, double-sided cooling power electronics module," in Proc. IEEE Energy Convers. Congr. Expo., 2012, pp. 444-450.
-
(2012)
Proc.IEEE Energy Convers. Congr. Expo.
, pp. 444-450
-
-
Zhang, H.1
Ang, S.S.2
Mantooth, A.3
Balda, J.C.4
-
11
-
-
77952185405
-
Low inductance power module with blade connector
-
L. D. Stevanovic, R. A. Beaupre, E. C. Delgado, and A. V. Gowda, "Low inductance power module with blade connector," in Proc. IEEE Appl. Power Electron. Conf. Expo., 2010, pp. 1603-1609.
-
(2010)
Proc.IEEE Appl. Power Electron. Conf. Expo.
, pp. 1603-1609
-
-
Stevanovic, L.D.1
Beaupre, R.A.2
Delgado, E.C.3
Gowda, A.V.4
-
12
-
-
78650156400
-
-
M.S. thesis, Dept. Electr. Eng., Virginia Tech. Blacksburg, VA, USA
-
Z. Chen, "Characterization and modeling of high-switching-speed behavior of SiC active devices," M.S. thesis, Dept. Electr. Eng., Virginia Tech., Blacksburg, VA, USA, 2009.
-
(2009)
Characterization and Modeling of High-switching-speed Behavior of SiC Active Devices
-
-
Chen, Z.1
-
13
-
-
84867796658
-
Development of a SiC JFET-based six-pack power module for a fully integrated inverter
-
Mar.
-
F. Xu, T. J.Han,D. Jiang, L. M. Tolbert, F.Wang, J. Nagashima, S. J. Kim, S. Kulkarni, and F. Barlow, "Development of a SiC JFET-based six-pack power module for a fully integrated inverter," IEEE Trans. Power Electron., vol. 28, no. 3, pp. 1464-1478, Mar. 2013.
-
(2013)
IEEE Trans. Power Electron.
, vol.28
, Issue.3
, pp. 1464-1478
-
-
Xu, F.1
Han, T.J.2
Jiang, D.3
Tolbert, L.M.4
Wang, F.5
Nagashima, J.6
Kim, S.J.7
Kulkarni, S.8
Barlow, F.9
-
14
-
-
33847146762
-
Power electronics' circuit Topology - The basic switching cells
-
DOI 10.1109/PEEW.2005.1567592, 1567592, IEEE Power Electronics Education Workshop 2005
-
F. Z. Peng, L. M. Tolbert, and F. H. Khan, "Power electronic circuit topology-The basic switching cells," in IEEE Power Electron. Edu. Workshop, 2005, pp. 52-57. (Pubitemid 46286946)
-
(2005)
IEEE Power Electronics Education Workshop 2005
, vol.2005
, pp. 52-57
-
-
Peng, F.Z.1
Tolbert, L.M.2
Khan, F.3
-
15
-
-
79955752836
-
P-cell and N-cell based IGBT module: Layout design, parasitic extraction, and experimental verification
-
S. Li, L. M. Tolbert, F. Wang, and F. Z. Peng, "P-cell and N-cell based IGBT module: Layout design, parasitic extraction, and experimental verification," in Proc. IEEE Appl. Power Electron. Conf. Expo., 2011, pp. 372-378.
-
(2011)
IEEE Proc. Appl. Power Electron. Conf. Expo.
, pp. 372-378
-
-
Li, S.1
Tolbert, L.M.2
Wang, F.3
Peng, F.Z.4
-
16
-
-
0030402631
-
Latest technology improvements ofMitsubishi IGBT modules
-
D. Medaule, Y. Arita, and Y. Yu, "Latest technology improvements ofMitsubishi IGBT modules," IEE Colloq. New Dev. Power Semicond. Devices, pp. 5/1-5/5, 1996.
-
(1996)
IEE Colloq. New Dev. Power Semicond. Devices
, pp. 51-55
-
-
Medaule, D.1
Arita, Y.2
Yu, Y.3
-
17
-
-
77951106338
-
Switching cells and their implications and applications in power electronic circuits
-
L. M. Tolbert, F. Z. Peng, F. H. Khan, and S. Li, "Switching cells and their implications and applications in power electronic circuits," in Proc. IEEE Int. Conf. Power Electron. Motion Control, 2009, pp. 773-779.
-
(2009)
IEEE Proc. Int. Conf. Power Electron. Motion Control
, pp. 773-779
-
-
Tolbert, L.M.1
Peng, F.Z.2
Khan, F.H.3
Li, S.4
-
18
-
-
78650103090
-
Reduction of stray inductance in power electronic modules using basic switching cells
-
S. Li, L. M. Tolbert, F. Wang, and F. Z. Peng, "Reduction of stray inductance in power electronic modules using basic switching cells," in Proc. IEEE Energy Convers. Congr. Expo., 2010, pp. 2686-2691.
-
(2010)
IEEE Proc. Energy Convers. Congr. Expo.
, pp. 2686-2691
-
-
Li, S.1
Tolbert, L.M.2
Wang, F.3
Peng, F.Z.4
-
19
-
-
84876909543
-
-
Ph.D. dissertation Dept. Electr. Eng. Comput. Sci., Univ. Tennessee, Knoxville, TX, USA
-
S. Li, "Packaging design of IGBT module using novel switching cells," Ph.D. dissertation, Dept. Electr. Eng. Comput. Sci., Univ. Tennessee, Knoxville, TX, USA, 2011.
-
(2011)
Packaging Design of IGBT Module Using Novel Switching Cells
-
-
Li, S.1
-
20
-
-
2342589310
-
Modeling and measurements of parasitic parameters for integrated power electronics modules
-
J. Z. Chen, L. Yang, D. Boroyevich, and W. G. Odendaal, "Modeling and measurements of parasitic parameters for integrated power electronics modules," in Proc. IEEE Appl. Power Electron. Conf. Expo., 2004, pp. 522-525.
-
(2004)
IEEE Proc. Appl. Power Electron. Conf. Expo.
, pp. 522-525
-
-
Chen, J.Z.1
Yang, L.2
Boroyevich, D.3
Odendaal, W.G.4
-
21
-
-
84897700740
-
-
FS800R07A2E3, Infineon, Neubiberg, Germany
-
HybridPack II datasheet, FS800R07A2E3, Infineon, Neubiberg, Germany, 2011.
-
(2011)
HybridPack II Datasheet
-
-
-
22
-
-
84876704044
-
-
Ph.D. dissertation Dept. Electr. Eng., VirginiaTech., Blacksburg, VA, USA
-
P. Ning, "Design and development of high density high temperature power module with cooling system," Ph.D. dissertation, Dept. Electr. Eng., VirginiaTech., Blacksburg, VA, USA, 2010.
-
(2010)
Design and Development of High Density High Temperature Power Module with Cooling System,"
-
-
Ning, P.1
-
23
-
-
84870550281
-
Investigation of Si IGBT operating at 200 C for traction application
-
May
-
Z. Xu, M. Li, F.Wang, and Z. Liang, "Investigation of Si IGBT operating at 200 C for traction application," IEEE Trans. Power Electron., vol. 28, no. 5, pp. 2604-2615, May 2013.
-
(2013)
IEEE Trans. Power Electron.
, vol.28
, Issue.5
, pp. 2604-2615
-
-
Xu, Z.1
Li, M.2
Wang, F.3
Liang, Z.4
-
24
-
-
84866489142
-
Automatic layout design for power module
-
Jan.
-
P. Ning, F. Wang, and K. D. T. Ngo, "Automatic layout design for power module," IEEE Trans. Power Electron., vol. 28, no. 1, pp. 481-487, Jan. 2013.
-
(2013)
IEEE Trans. Power Electron.
, vol.28
, Issue.1
, pp. 481-487
-
-
Ning, P.1
Wang, F.2
Ngo, K.D.T.3
-
25
-
-
84866489142
-
SiC Wirebond multichip phase-leg module packaging design and testing for harsh environment
-
P. Ning, R. Lai, D. Huff, F. Wang, K. D. T. Ngo, V. D. Immanuel, K. J. Immanuel, and K. J. Karimi, "SiC Wirebond multichip phase-leg module packaging design and testing for harsh environment," IEEE Trans. Power Electron., vol. 28, no. 1, pp. 481-487, 2013.
-
(2013)
IEEE Trans. Power Electron.
, vol.28
, Issue.1
, pp. 481-487
-
-
Ning, P.1
Lai, R.2
Huff, D.3
Wang, F.4
Ngo, K.D.T.5
Immanuel, V.D.6
Immanuel, K.J.7
Karimi, K.J.8
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