Millimeter-wave 3D integration techniques using LTCC and related multilayer circuits

2000 30th European Microwave Conference, EuMC 2000

Volumn , Issue , 2000, Pages

  Menzel, Wolfgang ^a   Kassner, Jürgen ^b  

^a UNIVERSITY OF ULM   (Germany)

^b IMST GMBH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; CHIP SCALE PACKAGES; COUPLED CIRCUITS; ELECTROMAGNETIC FIELDS; MILLIMETER WAVES; MULTILAYERS; THREE DIMENSIONAL;

CARRIER SUBSTRATE; CIRCUIT ELEMENTS; DIFFERENT SUBSTRATES; MM-WAVE APPLICATION; MULTILAYER CIRCUITS; MULTILAYER SUBSTRATE; SUBSTRATE STRUCTURE; TOLERANCE REQUIREMENT;

SUBSTRATES;

EID: 84897543296     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EUMA.2000.338762     Document Type: Conference Paper

References (11)

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