Vertical transitions in low temperature co-fired ceramics for LMDS applications

IEEE MTT-S International Microwave Symposium Digest

Volumn 1, Issue , 2001, Pages 1907-1910

  Panther, A ^a   Glaser, C ^b   Stubbs, M G ^b   Wight, J S ^a  

^a CARLETON UNIVERSITY   (Canada)

^b Radio Science Branch   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; INTEGRATED CIRCUIT MANUFACTURE; LOW TEMPERATURE PROPERTIES; MICROSTRIP LINES; MICROWAVE INTEGRATED CIRCUITS; WAVEGUIDE COMPONENTS;

GROUND PLANES; GROUNDING STRUCTURE; LOW TEMPERATURE COFIRED CERAMICS; MICROWAVE PACKAGES;

ELECTRONICS PACKAGING;

EID: 0035683101     PISSN: 0149645X     EISSN: None     Source Type: Journal    
DOI: 10.1109/MWSYM.2001.967281     Document Type: Article

References (7)

1. Designing a frequency synthesizer module using low temperature co-fired ceramic
2. Ceramic technology for integrated packaging for wireless
3. Characterization of low loss LTCC materials at 40 GHz
4. The use of metal filled via holes for improving isolation in LTCC RF and wireless multichip packages
5. Various excitation of coplanar waveguide
6. 3D FDTD analysis applied to the investigation of the resonant behavior of ceramic feedthrus
7. Wideband vertical transitions in low temperature cofired ceramics