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1
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0036063491
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SAW FEMs for GSM-based multi-band cellular phones with direct conversion demodulation
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Seattle, WA, June
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M. Hikita, N. Matsuura, K. Yokoyama, N. Shibagaki, L. Sakiyama: "SAW FEMs for GSM-Based Multi-Band Cellular Phones with Direct Conversion Demodulation", IEEE MTT-S Int. Microwave Symp. Dig., Seattle, WA, June 2002, pp. 1483-1486.
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(2002)
IEEE MTT-S Int. Microwave Symp. Dig.
, pp. 1483-1486
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-
Hikita, M.1
Matsuura, N.2
Yokoyama, K.3
Shibagaki, N.4
Sakiyama, L.5
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3
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0036068430
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3D Integrated LTCC module using μBGA technology for compact C-band RF front-end module
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Seattle, WA, June
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S. Pinel, S. Chakraborty, M. Roellig, R. Kunze, S. Mandal, H. Liang, C-H. Lee, R. Li, K. Lim, G. White, M. Tentzeris, and J. Laskar, "3D Integrated LTCC Module using μBGA technology for compact C-band RF Front-End Module," IEEE MTT-S Int. Microwave Symp. Dig., Seattle, WA, June 2002, pp. 1553-1556.
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(2002)
IEEE MTT-S Int. Microwave Symp. Dig.
, pp. 1553-1556
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Pinel, S.1
Chakraborty, S.2
Roellig, M.3
Kunze, R.4
Mandal, S.5
Liang, H.6
Lee, C.-H.7
Li, R.8
Lim, K.9
White, G.10
Tentzeris, M.11
Laskar, J.12
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4
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84897495515
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A 0.04 cc power amplifier module with fully integrated passives in a hybrid LTCC substrate for 5-GHz wireless LANs
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Milano, September
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S. Yamanouchi, K. Haraguchi, K. Kunihiro, K. Ikuina, M. Fujii, H. Hida, "A 0.04 cc Power Amplifier Module with Fully Integrated Passives in a Hybrid LTCC Substrate for 5-GHz Wireless LANs," 32nd EUMC, Milano, September 2002, pp. 465-468.
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(2002)
32nd EUMC
, pp. 465-468
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Yamanouchi, S.1
Haraguchi, K.2
Kunihiro, K.3
Ikuina, K.4
Fujii, M.5
Hida, H.6
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5
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0035695294
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A compact LTCC Ku-band transmitter module with integrated filter for satellite communication application
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Phoenix, AZ, May
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C.-H. Lee, A. Sutono, S. Han, and J. Laskar, "A Compact LTCC Ku-band Transmitter Module with Integrated Filter for Satellite Communication Application," IEEE MTT-S Int. Microwave Symp. Dig., Phoenix, AZ, May 2001, pp. 945-948.
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(2001)
IEEE MTT-S Int. Microwave Symp. Dig.
, pp. 945-948
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Lee, C.-H.1
Sutono, A.2
Han, S.3
Laskar, J.4
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7
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0035729025
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Recent advances in SAW packaging
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P. Selmeier, R., Grünwald, A. Przadka, H. Krüger, G. Feiertag, and C. Ruppel, "Recent Advances in SAW Packaging," IEEE Ultrasonics Symp., 2001, pp. 283-292.
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(2001)
IEEE Ultrasonics Symp.
, pp. 283-292
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Selmeier, P.1
Grünwald, R.2
Przadka, A.3
Krüger, H.4
Feiertag, G.5
Ruppel, C.6
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8
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57849116159
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SAW filters for 3G systems: A quantum leap in size and passive integration is ahead
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C. Eder, G. Fischerauer, R. Thomas, P. Hagn, G. Riha: "SAW Filters for 3G Systems: A Quantum Leap in Size and Passive Integration is Ahead", 2001 IEEE Ultrasonics Symp.
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2001 IEEE Ultrasonics Symp
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Eder, C.1
Fischerauer, G.2
Thomas, R.3
Hagn, P.4
Riha, G.5
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9
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84897491249
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Full 26 GHz MMIC chipset for telecom applications in SMD-type packages
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Milano, September
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K. Beilenhoff, P. Quentin, S. Tranchant, O. Vaudescal, M. Parisot, H. Dämbkes, "Full 26 GHz MMIC Chipset for Telecom Applications in SMD-Type Packages," 32nd EUMC, Milano, September 2002, pp. 275-278.
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(2002)
32nd EUMC
, pp. 275-278
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Beilenhoff, K.1
Quentin, P.2
Tranchant, S.3
Vaudescal, O.4
Parisot, M.5
Dämbkes, H.6
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