An overview of the technologies for adhesive debonding on command

Annals of "Dunarea de Jos" University of Galati, Fascicle XII, Welding Equipment and Technology

Volumn 24, Issue , 2013, Pages 11-14

  Banea, M D ^a   da Silva, L F M ^a   Campilho, R D S G ^b  

^a UNIVERSITY OF PORTO   (Portugal)

^b INSTITUTO SUPERIOR DE ENGENHARIA DO PORTO   (Portugal)

Author keywords

Additives; Adhesive; Nanoparticles; Thermally expandable particles (TEPs)

Indexed keywords

EID: 84896503151     PISSN: 12214639     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (26)

1. Banea, M.D. and L.F.M. da Silva, Adhesively bonded joints in composite materials: an overview. Proceedings of the Institution of Mechanical Engineers Part L-Journal of Materials-Design and Applications, vol. 223, no. 1, pp. 1-18, 2009.
2. Banea M.D., da Silva L.F.M., Campilho R.D.S.G., Sato C., Smart Adhesive Joints: An Overview of Recent Developments, Journal of Adhesion, vol. 90, no. 1, pp. 16-40, 2013.
3. Concil Directive (EC) 2000/53/EC of the European Parliament & Council, on ELV, 2000.
4. Morehouse, D.S.J. and R.J. Tetreault, Expansible thermoplastic polymer particles containing volatile fluid foaming agent and method of foaming the same. 1971, US Patent 3615972.
5. Matsumoto Yushi-Seiyaku Co., http://www.mtmtys.co.jp, 2013.
6. Expancel Home page. http://www.akzonobel.com/expancel/, 2013.
7. Tomalino, M. and G. Bianchini, Heat-expandable microspheres for car protection production. Progress in Organic Coatings, vol. 32(1-4), pp. 17-24, 1997.
8. Andersson, L. and L. Bergström, Gas-filled microspheres as an expandable sacrificial template for direct casting of complex-shaped macroporous ceramics. Journal of the European Ceramic Society, vol. 28, no. 15, pp. 2815-2821, 2008.
9. Sakurai, H. et al., Evaluation of adhesive properties of elastomeric adhesive. The development and utilization of the removable adhesive. Bulletin of Shizuoka Industrial Technology Research Center, vol. 43, pp. 11-16, 1998.
10. Ishikawa, H., et al., Bond strength and disbonding behavior of elastomer and emulsion-type dismantlable adhesives used for building materials. International Journal of Adhesion and Adhesives, vol. 25, no. 3, pp. 193-199, 2005.
11. Nishiyama, Y., et al., Dismantlement behavior and strength of dismantlable adhesive including thermally expansive particles. International Journal of Adhesion and Adhesives, vol. 23, no. 5, pp. 377-382, 2003.
12. Nishiyama, Y. and C. Sato, Behavior of dismantlable adhesives including thermally expansive microcapsules, in Adhesion-Current research and application, W. Possart, Editor. 2005, Wiley-VCH Verlag GmbH & Co. KGaA: Weinheim.
13. Kishi, H., et al., Design of dismantlable structural adhesives with high temperature performance. J. of the Adhesion Society of Japan, vol. 42, no. 9, pp. 356-363, 2006.
14. Kim, D., I. Chung, and G. Kim, Dismantlement studies of dismantlable polyurethane adhesive by controlling thermal property. Journal of Adhesion Science and Technology, pp. 1-19, 2012.
15. Rescoll Home page and http://rescoll.fr/, 2013.
16. Alcorta, J., M. Olive, and E. Papon, INDAR: INnovative dismantling adhesives research. JEC Composites Magazine, vol. 45, no. 40, pp. 65-66, 2008.
17. Kirsten, C., Process for adhesive separation of bonded joints. 2008, Henkel KGAa (Duesseldorf, DE) US patent no. 7407704.
18. Kolbe, J., et al., Curable bonded assemblies capable of being dissociated. 2009, Degussa AG (Duesseldorf, DE), Fraunhofer-GesellschaftzurFoerderung der AngewandtenForschung E.V. (Munich, DE): United States.
19. Aubert, J.H. and P.S. Sawyer, Thermally removable adhesive bonds. Assembly, vol. 46, no. 2, pp. 46-48, 2003.
20. Aubert, J.H., Thermally removable epoxy adhesives incorporating thermally reversible Diels-Alder adducts. Journal of Adhesion, vol. 79, no. 6, pp. 609-616, 2003.
21. Haydon, D.W., ElectRelease-Electrically disbonding epoxy adhesive. Assembly Automation, vol. 22, no. 4, pp. 326-329, 2002.
22. Leijonmarck, S., et al., Electrochemical Characterization of Electrically Induced Adhesive Debonding. Journal of the Electrochemical Society, vol.158, no.10, pp. P109-P114, 2011.
23. Leijonmarck, S., et al., Electrolytically assisted debonding of adhesives: An experimental investigation. International Journal of Adhesion and Adhesives, vol. 32, pp. 39-45, 2012.
24. ElectRelease™ Homepage. http://www.eiclabs.com/ERhome.htm, 2013.
25. Norberg P., et al., An electrochemically weakable adhesive and a laminate structure. 2008, WO/2008/150227.
26. Gilbert, M.D., Electrically disbonding materials. United States EIC Laboratories, Inc. (Norwood, MA, US), US patent no 7968188, 2011.