Thermally removable epoxy adhesives incorporating thermally reversible Diels-Alder adducts

Journal of Adhesion

Volumn 79, Issue 6, 2003, Pages 609-616

  Aubert, James H ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Adhesion; Diamine; Diels alder; Epoxy; Thermally removable; Thermally reversible

Indexed keywords

ABSORPTION SPECTROSCOPY; AMINES; DYNAMIC MECHANICAL ANALYSIS; ELASTIC MODULI; EPOXY RESINS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; FURAN RESINS; GLASS TRANSITION; SPECTROMETERS; TEMPERATURE; THERMAL EFFECTS; THERMOMECHANICAL TREATMENT;

DIEPOXY COMPOUND; EPOXY ADHESIVE; THERMALLY REVERSIBLE ADHESIVE; THERMALLY REVERSIBLE DIELS-ALDER ADDUCT;

PLASTIC ADHESIVES;

EID: 0041622995     PISSN: 00218464     EISSN: None     Source Type: Journal    
DOI: 10.1080/00218460309540     Document Type: Article

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