Dismantlement behavior and strength of dismantlable adhesive including thermally expansive particles

International Journal of Adhesion and Adhesives

Volumn 23, Issue 5, 2003, Pages 377-382

  Nishiyama, Yuichi ^a   Uto, Nobuyuki ^b   Sato, Chiaki ^a   Sakurai, Hiroaki ^c  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

^b Kaken Tech Co Ltd   (Japan)

^c Fuji Industrial Research Institute of Shizuoka Prefecture   (Japan)

Author keywords

A. Epoxy; A. Novel adhesive; D. Fracture; Dismantlement; E. Recycling

Indexed keywords

BOND STRENGTH (CHEMICAL); CRACKS; FRACTURE; STRESS ANALYSIS; THERMAL EXPANSION;

DISMANTLEMENT;

ADHESIVES;

EID: 0042524667     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0143-7496(03)00067-8     Document Type: Article

References (5)

1. USP 5,242,637, E. Patent 0407 996.
2. USP 4,844,833, J. Patent 2,131,217 and 2,136,376.
3. Sakurai H.et al. Evaluation of adhesive properties of elastomeric adhesive. The development and utilization of the removable adhesive. Bulletin of Shizuoka Industrial Technology Research Center. 43:1998;11-16. [in Japanese].
4. Ishikawa H. Development of bonding and debonding technology meeting recycle requirements. Proceedings of JSME Colloquium No. 01-86, 2001. p. 5-8 [in Japanese].
5. Hanafi M, Nishiyama Y, Sato C. Fracture mechanism of joints bonded by dismantlable adhesive including thermally expansive particles. Proceedings of EURADH 2002, Glasgow/UK, 2002. p. 133-6.