Thermally removable adhesive bonds

Assembly

Volumn 46, Issue 2, 2003, Pages 46-48

  Aubert, James H ^a   Sawyer, Patricia S ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC SYSTEMS; EPOXY ADHESIVES; THERMO-REVERSIBLE ADHESIVES;

CROSSLINKING; ELASTOMERS; ELECTROMECHANICAL DEVICES; EPOXY RESINS; FOAMS; GLASS TRANSITION; MOLECULAR WEIGHT; RECYCLING; THERMAL EFFECTS;

ADHESIVES;

EID: 2542587693     PISSN: 10508171     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

References (0)