Role of reactant concentration in size control of SnAgCu nanoparticles

Transactions of Nonferrous Metals Society of China (English Edition)

Volumn 23, Issue 6, 2013, Pages 1668-1673

  Zhang, Wei Peng ^a   Zhao, Bing Ge ^a   Zou, Chang Dong ^a   Zhai, Qi Jie ^a   Gao, Yu Lai ^a  

^a SHANGHAI UNIVERSITY   (China)

Author keywords

Chemical reduction method; Lead free solder; Nanoparticle; Reactant concentration; Size control; SnAgCu alloy

Indexed keywords

ELECTRONICS PACKAGING; ENAMELS; FIELD EMISSION MICROSCOPES; LEAD-FREE SOLDERS; NANOPARTICLES; PARTICLE SIZE; SCANNING ELECTRON MICROSCOPY; SYNTHESIS (CHEMICAL);

1 ,10-PHENANTHROLINE; CHEMICAL REDUCTION METHODS; ELECTRONIC PACKAGING; FIELD EMISSION SCANNING ELECTRON MICROSCOPY; REACTANT CONCENTRATIONS; SIZE CONTROL; SNAGCU ALLOYS; SODIUM BORO HYDRIDES;

PARTICLE SIZE ANALYSIS;

EID: 84893148840     PISSN: 10036326     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1003-6326(13)62646-1     Document Type: Article

References (22)

1. KIM K S, HUH S H, SUGANUMA K. Effects of cooling speed on microstructure and tensile properties of Sn-Ag-Cu alloys [J]. Materials Science and Engineering A, 2002, 333(1-2):106-114.
2. OHNUMA I, MIYASHITA M, ANZAI K, LIU X J, OHTANI H, KAINUMA R, ISHIDA K. Phase equilibria and the related properties of Sn-Ag-Cu based Pb-free solder alloys [J]. Journal of Electronic Materials, 2000, 29(10):1137-1144.
3. LEWIS D, ALLEN S, NOTIS M, SCOTCH A. Determination of the eutectic structure in the Ag-Cu-Sn system [J]. Journal of Electronic Materials, 2002, 31(2):161-167.
4. MILLER C M, ANDERSON I E, SMITH J F. A viable tin-lead solder substitute: Sn-Ag-Cu [J]. Journal of Electronic Materials, 1994, 23(7):595-601.
5. KIM K S, HUH S H, SUGANUMA K. Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints [J]. Journal of Alloys and Compounds, 2003, 352(1-2):226-236.
6. GAO Y L, ZOU C D, YANG B, ZHAI Q J, LIU J, ZHURAVLEV E, SCHICK C. Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy [J]. Journal of Alloys and Compounds, 2009, 484(1-2):777-781.
7. JESSER W A, SHNECK R Z, GILE W W. Solid-liquid equilibria in nanoparticles of Pb-Bi alloys [J]. Physical Review B, 2004, 69(14):144121.
8. BENJAMIN J S. Dispersion strengthened superalloys by mechanical alloying [J]. Metallurgical Transactions, 1970, 1(10):2943-2951.
9. BIRRINGER R, GLEITER H, KLEIN H P, MARQUARDT P. Nanocrystalline materials an approach to a novel solid structure with gas-like disorder? [J]. Physics Letters A, 1984, 102(8):365-369.
10. ZHANG Qiu-li, YANG Zhi-mao, DING Bing-jun, LAN Xin-zhe, GUO Ying-juan. Preparation of copper nanoparticles by chemical reduction method using potassium borohydride [J]. Transactions of Nonferrous Metals Society of China, 2010, 20(s1):s240-s244.
11. ZHENG Min, WANG Zuo-shan, ZHU Ya-wei. Preparation of silver nanoparticle via active template under ultrasonic [J]. Transactions of Nonferrous Metals Society of China, 2006, 16:1348-1352.
12. ZOU Chang-dong, GAO Yu-lai, YANG Bin, ZHAI Qi-jie. Nanoparticles of Sn3.0Ag0.5Cu alloy synthesized at room temperature with large melting temperature depression [J]. Journal of Materials Science: Materials in Electronics, 2012, 23(1):2-7.
13. ZOU Chang-dong, GAO Yu-lai, YANG Bin, ZHAI Qi-jie. Melting and solidification properties of the nanoparticles of Sn3.0Ag0.5Cu lead-free solder alloy [J]. Materials Characterization, 2010, 61(4):474-480.
14. LIN C Y, MOHANTY U S, CHOU J H. Synthesis and characterization of Sn-3.5Ag-X Zn alloy nanoparticles by the chemical reduction method [J]. Journal of Alloys and Compounds, 2009, 472(1-2):281-285.
15. JIANG H J, MOON K S, HUA F, WONG C P. Synthesis and thermal and wetting properties of tin/silver alloy nanoparticles for low melting point lead-free solders [J]. Chemistry of Materials, 2007, 19(18):4482-4485.
16. JIANG H J, MOON K S, WONG C P. Tin/silver/copper alloy nanoparticle pastes for low temperature lead-free interconnect applications [C]//58th Electronic Components and Technology Conference. New York: IEEE, 2008:1400-1404.
17. HSIAO L Y, DUH J G Synthesis and characterization of lead-free solders with Sn-3.5Ag-xCu (x=0.2, 0.5, 1.0) alloy nanoparticles by the chemical reduction method [J]. Journal of the Electrochemical Society, 2005, 152(9):J105-J109.
18. FISKER R, CARSTENSEN J M, HANSEN M F, BØDKER F, MØRUP S. Estimation of nanoparticle size distributions by image analysis [J]. Journal of Nanoparticle Research, 2000, 2(3):267-277.
19. CUSHING B L, KOLESNICHENKO V L, O'CONNOR C J. Recent advances in the liquid-phase syntheses of inorganic nanoparticles [J]. Chemical Reviews, 2004, 104(9):3893-3946.
20. LIFSHITZ I M, SLYOZOV V V. The kinetics of precipitation from supersaturated solid solutions [J]. Journal of Physics and Chemistry of Solids, 1961, 19(1-2):35-50.
21. WAGNER C. Theorie der alterung von niederschlägen durch umlösen (Ostwald-Reifung) [J]. Zeitschrift für Elektrochemie, Berichte der Bunsengesellschaft für physikalische Chemie, 1961, 65(7-8):581-591.
22. TOKUYAMA M, KAWASAKI K, ENOMOTO Y Kinetic equations for Ostwald ripening [J]. Physica A, 1986, 134(2):323-338.