A High Vacuum Fracture Facility for Molecular Interactions

Experimental Mechanics

Volumn 53, Issue 2, 2013, Pages 231-241

  Liechti, K M ^a   Na, S R ^a   Wakamatsu, M ^a   Seitz, O ^b   Chabal, Y ^b  

^a The University of Texas at Austin   (United States)

^b The University of Texas at Dallas   (United States)

Author keywords

High vacuum fracture; Infrared crack opening interferometry; Molecular interactions; Self assembled monolayers

Indexed keywords

AMINES; FRACTURE; INTERFEROMETRY; MOLECULAR INTERACTIONS; MOLECULAR STRUCTURE; SELF ASSEMBLED MONOLAYERS; STRESS INTENSITY FACTORS; CRACKS; SILICON;

CRACK FRONTS; FUNCTIONALIZED; HIGH VACUUM; INFRARED CRACK OPENING INTERFEROMETRIES; MIXED MODE FRACTURE; NORMAL CRACKS; SILICON SURFACES; TRACTION-SEPARATION RELATION;

CRACKS; FRACTURE;

EID: 84892889755     PISSN: 00144851     EISSN: 17412765     Source Type: Journal    
DOI: 10.1007/s11340-012-9625-1     Document Type: Article

References (41)

1. Kojio K, Ge S, Takahara A, Kajiyama T (1998) Molecular aggregation state of n-octadecyltrichlorosilane monolayer prepared at an air/water interface. Langmuir 14: 971-974.
2. Ulman A (1991) An introduction to ultra thin organic films from langmuir-blodgett to self-assembly. Academic Press, Inc.
3. Ulman A (1996) Formation and structure of self-assembled monolayers. Chem Rev 96: 1533-1554.
4. Zhuk AV, Evans AG, Hutchinson JW, Whitesides GM (1998) The adhesion energy between polymer thin films and self-assembled monolayers. J Mater Res 13: 3555-3564.
5. Kent MS, Reedy ED, Yim H, Matheson A, Sorenson J, Hall J, Schubert K, Tallant D, Garcia M, Ohlhausen T, Assink R (2004) Using self-assembling monolayers to study crack initiation in epoxy/silicon joints. J Mater Res 19: 1682-1695.
6. Mello AV, Liechti KM (2006) The effect of self-assembled monolayers on interfacial fracture. J Appl Mech 73: 860-870.
7. Bhushan B (1999) Handbook of micro/nano tribology. CRC Press.
8. DeBoer MP, Mayer TM (2001) Tribology of MEMS. MRS Bull 26: 302.
9. Maboudian R, Ashurst WR, Carraro C (2002) Tribological challenges in micromechanical systems. Tribol Lett 12: 95-100.
10. Romrig ADJ, Dugger MT, McWhorter PJ (2003) Materials issues in microelectromechanical devices: science, engineering, manufacturability and reliability. Acta Materialia 51: 5837-5866.
11. Houston JE, Kim HI (2002) Adhesion, friction and mechanical properties of functionalized alkanethiol self-assembled monolayers. Acc Chem Res 35: 547-553.
12. Carpick RW, Agraït N, Ogletree DF, Salmeron M (1996) Variation of the interfacial shear strength and adhesion of a nanometer-sized contact. Langmuir 12: 3334-3340.
13. Wang M, Liechti KM, Srinivasan V, White JM, Rossky PJ, Stone TM (2006) A hybrid molecular-continuum analysis of IFM experiments of a self-assembled monolayer. J Appl Mech 73: 769-777.
14. Johnson KL, Kendall K, Roberts AD (1971) Surface energy and the contact of elastic solids. Proc Roy Soc Lond Math Phys Sci 324(1558): 301-313.
15. Derjaguin RV, Muller VM, Toporov YP (1975) Effect of contact deformations on the adhesion of particles. J Colloid Interface Sci 53: 314-326.
16. Maugis D (1992) Adhesion of spheres: the JKR-DMT transition using a Dugdale model. J Colloid Interface Sci 150: 243-269.
17. Frisbie CD, Rozsnyai LF, Noy A, Wrighton MS, Lieber CM (1994) Functional group imaging by chemical force microscopy. Science 265: 2071-2074.
18. Swalen JD, Allara DL, Andrade JD, Chandross EA, Garoff S, Israelachvili J, McCarthy TJ, Murray R, Pease RF, Rabolt JF, Wynne KJ, Yu H (1987) Molecular monolayers and films. Langmuir 3: 932-950.
19. Tong QY, Gösele U (1999) Semiconductor wafer bonding: science and technology. Wiley, New York.
20. Maszara WP, Goetz G, Caviglia A, Mckitterick JB (1988) J Appl Phys 64: 4943.
21. Petzold M, Bagdahn J, Katzer D (1999) Microelectron Reliab 39: 1103.
22. Turner KT, Spearing SM (2008) Accurate characterization of wafer bond toughness with the double cantilever beam specimen. J Appl Phys 103: 013514.
23. Tadepalli R, Turner KT, Thompson CV (2008) Mixed-mode interface toughness of wafer-level Cu-Cu bonds using asymmetric chevron test. J Mech Phys Solid 56(3): 707-718.
24. Tsau CH, Spearing SM, Schmidt MA (2004) Characterization of wafer-level thermocompression bonds. J Microelectromech Syst 13(6): 963-971.
25. Charalambides PG, Lund J, Evans AG, McMeeking RM (1989) A test specimen for determining the fracture resistance of bimaterial interfaces. J Appl Mech 56: 77-82.
26. Higashi GS, Becker RS, Chabal YJ, Becker AJ (1991) Comparison of Si(111) surfaces prepared using aqueous solutions of NH[sub 4]F versus HF. Appl Phys Lett 58(15): 1656-1658.
27. Wakamatsu M (2008) Fracture at the molecular level, in aerospace engineering and engineering mechanics. University of Texas at Austin, Austin.
28. Wang M, Liechti KM, Wang Q, White JM (2005) Self-assembled silane monolayers: fabrication with nanoscale uniformity. Langmuir 18: 1848-1857.
29. Hutchinson JW, Suo Z (1992) Mixed mode cracking in layered materials. Adv Appl Mech 29: 63-199, 29.
30. Liechti KM (1993) On the use of classical interferometry techniques in fracture mechanics. In: Epstein JS (ed) Experimental techniques in fracture, chapter 4, IIIth edn. VCH Publishers, New York, pp 95-124.
31. Li VC, Chan C-M, Leung CKY (1987) Experimental determination of the tension-softening relations for cementitious composites. Cem Concr Res 17: 441-452.
32. Sorensen BF, Jacobsen TK (2003) Determination of cohesive laws by the J integral approach. Eng Fract Mech 70(14): 1841-1858.
33. Sorensen BF, Kirkegaard P (2006) Determination of mixed mode cohesive laws. Eng Fract Mech 73(17): 2642-2661.
34. Högberg JL, Sorensen BF, Stigh U (2007) Constitutive behaviour of mixed mode loaded adhesive layer. Int J Solids Struct 44: 8335-8354.
35. Zhu Y, Liechti KM, Ravi-Chandar K (2009) Direct extraction of rate-dependent traction-separation laws for polyurea/steel interfaces. Int J Solids Struct 46(1): 31-51.
36. Parmigiani JP, Thouless MD (2007) The effects of cohesive strength and toughness on mixed-mode delamination of beam-like geometries. Eng Fract Mech 74: 2675-2699.
37. Turner KT, Spearing SM (2006) Mechanics of direct wafer bonding. Proc Roy Soc A 462: 171-188.
38. Miki N, Spearing SM (2003) Effect of nanoscale surface roughness on the bonding energy of direct-bonded silicon wafers. J Appl Phys 94: 6800-6806.
39. Tromans D, Meech JA (2002) Fracture toughness and surface energies of minerals: theoretical estimates for oxides, sulphides, silicates and halides. Miner Eng 15(12): 1027-1041.
40. Cole DJ, Payne MC, Csanyi G, Spearing SM, Ciacchi LC (2007) Development of a classical force field for the oxidized Si surface: Application to hydrophilic wafer bonding. J Chem Phys 127(20): 204704-204712.
41. Higashi GS, Chabal YJ, Trucks GW, Raghavachari K (1990) Ideal Hydrogen Termination of the Silicon (111) Surface. Appl Phys Lett 56: 656.