Accurate characterization of wafer bond toughness with the double cantilever specimen

Journal of Applied Physics

Volumn 103, Issue 1, 2008, Pages

  Turner, Kevin T ^a   Spearing, S Mark ^b  

^a University of Wisconsin Madison   (United States)

^b UNIVERSITY OF SOUTHAMPTON   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; INTERFACIAL ENERGY; MATHEMATICAL MODELS; SURFACE TENSION; TOUGHNESS;

DIRECT WAFER BONDS; DOUBLE CANTILEVER SPECIMEN;

WAFER BONDING;

EID: 38149076509     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2828156     Document Type: Article

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