Heterogeneous integration: Building the foundation for innovative products

More than Moore: Creating High Value Micro/Nanoelectronics Systems

Volumn , Issue , 2009, Pages 279-303

  Reichl, Herbert ^a,b   Aschenbrenner, Rolf ^a,b   Töpper, Michael ^a,b   Pötter, Harald ^a,b  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^b FRAUNHOFER IZM   (Germany)

Author keywords

3D integration; Board level integration; Chip embedding into flexible substrates; Chip in polymer; Embedding of passive components; Functional layer technology; Functional packaging; Integrated passives; Integration of biological functionalities; Module integration technologies; Package stacking; System in package; Thin chip integration; Through silicon vias; Wafer level integration

Indexed keywords

EID: 84892344551     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1007/978-0-387-75593-9_9     Document Type: Chapter

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