Novel microstructuring technology for glass on silicon and glass-substrates

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 939-942

  Mund, Dietrich ^a   Leib, Jürgen ^a  

^a SCHOTT Electronic Packaging GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

HERMETIC DEVICES; LITHOGRAPHY; MICROMETERS; MICROSTRUCTURE; PHOTORESISTORS; SILICON; SUBSTRATES; SYNTHESIS (CHEMICAL); WSI CIRCUITS;

GLASS-SUBSTRATES; MASK-ALIGNER LITHOGRAPHY; MICROSTRUCTURE TECHNOLOGY; PRE-STRUCTURING-PROCESS;

GLASS;

EID: 10644290306     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Esashi, M. et al, "Low Temperature Silicon-to-Silicon Anodic Bonding with Intermediate Low-Melting-Point Glass", Sensors Actuators, A 21-23, p 931 (1990)
2. Hanneborg, A. et al, "Silicon-to-Thin -Film Anodic Bonding, J. Micromech. Microeng., Vol2, p. 117 (1992)
3. Krause, P et al, "Silicon to Silicon anodic bonding using evaporated glass", Technical Digest of Transducers 95, Eurosensors IX, Stockholm, 1995
4. Kulke, R. et al, "RF Benchmark up to 40 GHz for various Low Loss Tapes", Acceptetd Paper for IMAPS-Nordic, Stockholm 2002