-
1
-
-
84859214431
-
2 Hf/HfOx crossbar resistive RAM with excellent performance, reliability and low-energy operation
-
Dec.
-
2 Hf/HfOx crossbar resistive RAM with excellent performance, reliability and low-energy operation," in Proc. IEEE IEDM, Dec. 2011, pp. 729-732.
-
(2011)
Proc. IEEE IEDM
, pp. 729-732
-
-
Govoreanu, B.1
Kar, G.S.2
Chen, Y.3
-
2
-
-
77952686415
-
Improved bipolar resistive switching of HfOx/TiN stack with a reactive metal layer and post metal annealing
-
Apr.
-
P.-S. Chen, H.-Y. Lee, Y.-S. Chen, et al., "Improved bipolar resistive switching of HfOx/TiN stack with a reactive metal layer and post metal annealing," Jpn. J. Appl. Phys., vol. 49, pp. 04DD18-1-04DD18-5, Apr. 2009.
-
(2009)
Jpn. J. Appl. Phys.
, vol.49
-
-
Chen, P.-S.1
Lee, H.-Y.2
Chen, Y.-S.3
-
3
-
-
84894303678
-
Real-time study of switching kinetics in integrated 1T/HfOx 1R RRAM: Intrinsic tunability of set/reset voltage and trade-off with switching time
-
Dec.
-
S. Koveshnikov, K. Matthews, K. Min, et al., "Real-time study of switching kinetics in integrated 1T/HfOx 1R RRAM: Intrinsic tunability of set/reset voltage and trade-off with switching time," in Proc. IEEE IEDM, Dec. 2012, pp. 486-488.
-
(2012)
Proc. IEEE IEDM
, pp. 486-488
-
-
Koveshnikov, S.1
Matthews, K.2
Min, K.3
-
4
-
-
80052072437
-
Scaling effect of device area and film thickness on electrical and reliability characteristics of RRAM
-
May
-
J. Lee, J. Park, S. Jung, et al., "Scaling effect of device area and film thickness on electrical and reliability characteristics of RRAM," in Proc. IEEE IITC/MAM, May 2011, pp. 1-3.
-
(2011)
Proc. IEEE IITC/MAM
, pp. 1-3
-
-
Lee, J.1
Park, J.2
Jung, S.3
-
5
-
-
50249116815
-
Improvement of endurance and switching stability of forming-free CuxO RRAM
-
May
-
H. B. Lv, M. Yin, P. Zhou, et al., "Improvement of endurance and switching stability of forming-free CuxO RRAM," in Proc. NVSMW/ICMTD, May 2008, pp. 52-53.
-
(2008)
Proc. NVSMW/ICMTD
, pp. 52-53
-
-
Lv, H.B.1
Yin, M.2
Zhou, P.3
-
6
-
-
84861657438
-
In-depth study on the effect of active-area scale-down of solution-processed TiOx
-
Jun.
-
S. Jung, J. Kong, T.-W. Kim, et al., "In-depth study on the effect of active-area scale-down of solution-processed TiOx," IEEE Electron Device Lett., vol. 33, no. 6, pp. 869-871, Jun. 2012.
-
(2012)
IEEE Electron Device Lett.
, vol.33
, Issue.6
, pp. 869-871
-
-
Jung, S.1
Kong, J.2
Kim, T.-W.3
-
7
-
-
79955442181
-
A forming-free WOx resistive memory using a novel self-aligned field enhancement feature with excellent reliability and scalability
-
Dec.
-
W. C. Chien, Y. R. Chen, Y. C. Chen, et al., "A forming-free WOx resistive memory using a novel self-aligned field enhancement feature with excellent reliability and scalability," in Proc. IEEE IEDM, Dec. 2010, pp. 440-443.
-
(2010)
Proc. IEEE IEDM
, pp. 440-443
-
-
Chien, W.C.1
Chen, Y.R.2
Chen, Y.C.3
-
8
-
-
0035362378
-
New physics-based analytic approach to the thin-oxide breakdown statistics
-
DOI 10.1109/55.924847, PII S0741310601046729
-
J. Sune, "New physics-based analytic approach to the thin-oxide breakdown statistics," IEEE Electron Device Lett., vol. 22, no. 6, pp. 296-298, Jun. 2001. (Pubitemid 32585000)
-
(2001)
IEEE Electron Device Letters
, vol.22
, Issue.6
, pp. 296-298
-
-
Sune, J.1
-
9
-
-
76649133422
-
Atomic structure of conducting nanofilaments in TiO2 resistive switching memory
-
Jan.
-
D.-H. Kwon, K. M. Kim, J. H. Jang, et al., "Atomic structure of conducting nanofilaments in TiO2 resistive switching memory," Nature Nanotechnol., vol. 5, pp. 148-153, Jan. 2010.
-
(2010)
Nature Nanotechnol.
, vol.5
, pp. 148-153
-
-
Kwon, D.-H.1
Kim, K.M.2
Jang, J.H.3
-
10
-
-
43349101629
-
Random circuit breaker network model for unipolar resistance switching
-
Mar.
-
S. C. Chae, J. S. Lee, S. Kim, et al., "Random circuit breaker network model for unipolar resistance switching," Adv. Mater., vol. 20, no. 6, pp. 1154-1159, Mar. 2008.
-
(2008)
Adv. Mater.
, vol.20
, Issue.6
, pp. 1154-1159
-
-
Chae, S.C.1
Lee, J.S.2
Kim, S.3
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