Rensselaer 3D Integration Processes

Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits

Volumn 2, Issue , 2008, Pages 447-462

  Lu, James Jian Qiang ^a   Cale, Tim S ^a   Gutmann, Ronald J ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

3D hyper integration platform; Benzocyclobutene (BCB); Carbon nanotube; Cu inter wafer interconnects; Rensselaer; Through silicon via; Wafer alignment; Wafer bonding; Wafer thinning

Indexed keywords

EID: 84891286264     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1002/9783527623051.ch23     Document Type: Chapter

References (23)

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