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Volumn 3203, Issue , 2004, Pages 874-880

Exploring potential benefits of 3D FPGA integration

Author keywords

[No Author keywords available]

Indexed keywords

DELAY CIRCUITS; INTEGRATION; WIRE;

EID: 84889831892     PISSN: 03029743     EISSN: 16113349     Source Type: Book Series    
DOI: 10.1007/978-3-540-30117-2_92     Document Type: Conference Paper
Times cited : (33)

References (13)
  • 2
    • 0036928172 scopus 로고    scopus 로고
    • Electrical integrity of state-of-the-art 0.13um SOI CMOS devices and circuits transferred for three-dimensional (3D) integrated circuit (IC) fabrication
    • Guarini, K.W., et al.: Electrical integrity of state-of-the-art 0.13um SOI CMOS devices and circuits transferred for three-dimensional (3D) integrated circuit (IC) fabrication. Technical Digest of the International Electron Devices Meeting (2002) 943-945
    • (2002) Technical Digest of the International Electron Devices Meeting , pp. 943-945
    • Guarini, K.W.1
  • 5
    • 0033361395 scopus 로고    scopus 로고
    • A spiffy tool for the simultaneous placement and global routing for three-dimensional field-programmable gate arrays
    • Karro, J., Cohoon, J.P.: A spiffy tool for the simultaneous placement and global routing for three-dimensional field-programmable gate arrays. Great Lakes Symposium on VLSI (1999) 226-227
    • (1999) Great Lakes Symposium on VLSI , pp. 226-227
    • Karro, J.1    Cohoon, J.P.2
  • 6
    • 0035242920 scopus 로고    scopus 로고
    • Design and Analysis of a Dynamically Reconfigurable Three-Dimensional FPGA
    • Chiricescu, S., Leeser, M., Vai, M.M.: Design and Analysis of a Dynamically Reconfigurable Three-Dimensional FPGA. IEEE Trans. VLSI Systems, Vol. 9, No. 1, (2001) 186-196
    • (2001) IEEE Trans. VLSI Systems , vol.9 , Issue.1 , pp. 186-196
    • Chiricescu, S.1    Leeser, M.2    Vai, M.M.3
  • 7
    • 84957870821 scopus 로고    scopus 로고
    • VPR: A New Packing Placement and Routing Tool for FPGA Research
    • Betz, V., Rose, J.: VPR: A New Packing Placement and Routing Tool for FPGA Research. Field-Programmable Logic App. (1997) 213-222
    • (1997) Field-Programmable Logic App , pp. 213-222
    • Betz, V.1    Rose, J.2
  • 9
    • 0032659075 scopus 로고    scopus 로고
    • Using Cluster-Based Logic Blocks and Timing-Driven Packing to Improve FPGA Speed and Density
    • Marquardt, A., Betz, V., Rose, J.: Using Cluster-Based Logic Blocks and Timing-Driven Packing to Improve FPGA Speed and Density. Proc. International FPGA Conf. (1999) 37-46
    • (1999) Proc. International FPGA Conf , pp. 37-46
    • Marquardt, A.1    Betz, V.2    Rose, J.3
  • 10
    • 0030686036 scopus 로고    scopus 로고
    • Multi-level Hypergraph Partitioning: Applications in VLSI Design
    • Karypis, G., Aggarwal, R., Kumar, V., Shekhar, S.: Multi-level Hypergraph Partitioning: Applications in VLSI Design. Proc. ACM/IEEE DAC (1997) 526-529
    • (1997) Proc. ACM/IEEE DAC , pp. 526-529
    • Karypis, G.1    Aggarwal, R.2    Kumar, V.3    Shekhar, S.4
  • 11
    • 84942012494 scopus 로고    scopus 로고
    • Three-Dimensional Integrated Circuits: Performance Design Methodology and CAD Tools
    • Das, S., Chandrakasan, A., Reif, R.: Three-Dimensional Integrated Circuits: Performance Design Methodology and CAD Tools. Proc. International Symposium on VLSI (2003) 13-19
    • (2003) Proc. International Symposium on VLSI , pp. 13-19
    • Das, S.1    Chandrakasan, A.2    Reif, R.3
  • 12
    • 2942639675 scopus 로고    scopus 로고
    • Technology, performance, and computer-aided design of three-dimensional integrated circuits
    • Das, S., et al.: Technology, performance, and computer-aided design of three-dimensional integrated circuits. Proc. ACM/IEEE ISPD (2004) 108-115
    • (2004) Proc. ACM/IEEE ISPD , pp. 108-115
    • Das, S.1
  • 13
    • 0035789319 scopus 로고    scopus 로고
    • Wiring Requirement and Three- Dimensional Integration of Field-Programmable Gate Arrays
    • Rahman, A., Das, S., Chandrakasan, A., Reif, R.: Wiring Requirement and Three- Dimensional Integration of Field-Programmable Gate Arrays. Proc. ACM/IEEE SLIP (2001) 107-113
    • (2001) Proc. ACM/IEEE SLIP , pp. 107-113
    • Rahman, A.1    Das, S.2    Chandrakasan, A.3    Reif, R.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.