-
1
-
-
84948471389
-
Fabrication Technologies for Three-Dimensional Integrated Circuits
-
Reif, R., Fan, A., Chen, K.-N., Das, S.: Fabrication Technologies for Three-Dimensional Integrated Circuits. Proc. International Symposium on Quality Electronic Design (2002) 33-37
-
(2002)
Proc. International Symposium on Quality Electronic Design
, pp. 33-37
-
-
Reif, R.1
Fan, A.2
Chen, K.-N.3
Das, S.4
-
2
-
-
0036928172
-
Electrical integrity of state-of-the-art 0.13um SOI CMOS devices and circuits transferred for three-dimensional (3D) integrated circuit (IC) fabrication
-
Guarini, K.W., et al.: Electrical integrity of state-of-the-art 0.13um SOI CMOS devices and circuits transferred for three-dimensional (3D) integrated circuit (IC) fabrication. Technical Digest of the International Electron Devices Meeting (2002) 943-945
-
(2002)
Technical Digest of the International Electron Devices Meeting
, pp. 943-945
-
-
Guarini, K.W.1
-
3
-
-
0002455158
-
Placement and Routing for Three-Dimensional FPGAs
-
Alexander, A.J., Cohoon, J.P., Colflesh, J.L., Karro, J., Peters, J.L., Robins, G.: Placement and Routing for Three-Dimensional FPGAs. Canadian Workshop on Field-Programmable Devices (1996) 11-18
-
(1996)
Canadian Workshop on Field-Programmable Devices
, pp. 11-18
-
-
Alexander, A.J.1
Cohoon, J.P.2
Colflesh, J.L.3
Karro, J.4
Peters, J.L.5
Robins, G.6
-
4
-
-
0029510886
-
Three-Dimensional Field-Programmable Gate Arrays
-
Alexander, A.J., Cohoon, J.P., Colflesh, J.L., Karro, J., Robins, G.: Three-Dimensional Field-Programmable Gate Arrays. Proc. International ASIC Conf. (1995) 253-256
-
(1995)
Proc. International ASIC Conf
, pp. 253-256
-
-
Alexander, A.J.1
Cohoon, J.P.2
Colflesh, J.L.3
Karro, J.4
Robins, G.5
-
5
-
-
0033361395
-
A spiffy tool for the simultaneous placement and global routing for three-dimensional field-programmable gate arrays
-
Karro, J., Cohoon, J.P.: A spiffy tool for the simultaneous placement and global routing for three-dimensional field-programmable gate arrays. Great Lakes Symposium on VLSI (1999) 226-227
-
(1999)
Great Lakes Symposium on VLSI
, pp. 226-227
-
-
Karro, J.1
Cohoon, J.P.2
-
6
-
-
0035242920
-
Design and Analysis of a Dynamically Reconfigurable Three-Dimensional FPGA
-
Chiricescu, S., Leeser, M., Vai, M.M.: Design and Analysis of a Dynamically Reconfigurable Three-Dimensional FPGA. IEEE Trans. VLSI Systems, Vol. 9, No. 1, (2001) 186-196
-
(2001)
IEEE Trans. VLSI Systems
, vol.9
, Issue.1
, pp. 186-196
-
-
Chiricescu, S.1
Leeser, M.2
Vai, M.M.3
-
7
-
-
84957870821
-
VPR: A New Packing Placement and Routing Tool for FPGA Research
-
Betz, V., Rose, J.: VPR: A New Packing Placement and Routing Tool for FPGA Research. Field-Programmable Logic App. (1997) 213-222
-
(1997)
Field-Programmable Logic App
, pp. 213-222
-
-
Betz, V.1
Rose, J.2
-
9
-
-
0032659075
-
Using Cluster-Based Logic Blocks and Timing-Driven Packing to Improve FPGA Speed and Density
-
Marquardt, A., Betz, V., Rose, J.: Using Cluster-Based Logic Blocks and Timing-Driven Packing to Improve FPGA Speed and Density. Proc. International FPGA Conf. (1999) 37-46
-
(1999)
Proc. International FPGA Conf
, pp. 37-46
-
-
Marquardt, A.1
Betz, V.2
Rose, J.3
-
10
-
-
0030686036
-
Multi-level Hypergraph Partitioning: Applications in VLSI Design
-
Karypis, G., Aggarwal, R., Kumar, V., Shekhar, S.: Multi-level Hypergraph Partitioning: Applications in VLSI Design. Proc. ACM/IEEE DAC (1997) 526-529
-
(1997)
Proc. ACM/IEEE DAC
, pp. 526-529
-
-
Karypis, G.1
Aggarwal, R.2
Kumar, V.3
Shekhar, S.4
-
11
-
-
84942012494
-
Three-Dimensional Integrated Circuits: Performance Design Methodology and CAD Tools
-
Das, S., Chandrakasan, A., Reif, R.: Three-Dimensional Integrated Circuits: Performance Design Methodology and CAD Tools. Proc. International Symposium on VLSI (2003) 13-19
-
(2003)
Proc. International Symposium on VLSI
, pp. 13-19
-
-
Das, S.1
Chandrakasan, A.2
Reif, R.3
-
12
-
-
2942639675
-
Technology, performance, and computer-aided design of three-dimensional integrated circuits
-
Das, S., et al.: Technology, performance, and computer-aided design of three-dimensional integrated circuits. Proc. ACM/IEEE ISPD (2004) 108-115
-
(2004)
Proc. ACM/IEEE ISPD
, pp. 108-115
-
-
Das, S.1
-
13
-
-
0035789319
-
Wiring Requirement and Three- Dimensional Integration of Field-Programmable Gate Arrays
-
Rahman, A., Das, S., Chandrakasan, A., Reif, R.: Wiring Requirement and Three- Dimensional Integration of Field-Programmable Gate Arrays. Proc. ACM/IEEE SLIP (2001) 107-113
-
(2001)
Proc. ACM/IEEE SLIP
, pp. 107-113
-
-
Rahman, A.1
Das, S.2
Chandrakasan, A.3
Reif, R.4
|