Copper-based conductive composites with tailored thermal expansion

ACS Applied Materials and Interfaces

Volumn 5, Issue 21, 2013, Pages 10966-10974

  Della Gaspera, Enrico ^a,c   Tucker, Ryan ^a   Star, Kurt ^a,b   Lan, Esther H ^a   Ju, Yongho Sungtaek ^a   Dunn, Bruce ^a  

^a Engineering IV   (United States)

^b CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

^c CSIRO   (Australia)

Author keywords

colloidal synthesis; electrical properties; nanoparticles; negative thermal expansion; sintering; zirconium tungstate

Indexed keywords

COLLOIDAL SYNTHESIS; CONDUCTIVITY PROPERTIES; HIGH ELECTRICAL CONDUCTIVITY; NEGATIVE THERMAL EXPANSION; THERMAL EXPANSION COEFFICIENTS; THERMO-ELECTRIC MATERIALS; THERMOELECTRIC DEVICES; ZIRCONIUM TUNGSTATE;

COPPER; ELECTRIC PROPERTIES; HOT PRESSING; METAL PRESSING; NANOPARTICLES; SEMICONDUCTOR DEVICES; SINTERING; SYNTHESIS (CHEMICAL); THERMAL CONDUCTIVITY; THERMAL EXPANSION; THERMOELECTRICITY;

METALLIC MATRIX COMPOSITES;

COPPER; METAL NANOPARTICLE;

ARTICLE; CHEMISTRY; PARTICLE SIZE; SURFACE PROPERTY; TEMPERATURE; THERMAL CONDUCTIVITY; THERMODYNAMICS;

COPPER; METAL NANOPARTICLES; PARTICLE SIZE; SURFACE PROPERTIES; TEMPERATURE; THERMAL CONDUCTIVITY; THERMODYNAMICS;

EID: 84887581843     PISSN: 19448244     EISSN: 19448252     Source Type: Journal    
DOI: 10.1021/am403227c     Document Type: Article

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