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Journal of Electronic Materials

Volumn 41, Issue 6, 2012, Pages 1020-1023

Metal-matrix nanocomposites with tailored coefficients of thermal expansion for improved thermomechanical reliability

(6) Trujillo, J E a Kim, J W a Lan, E H a Sharratt, S a Ju, Y S a Dunn, B a

a UNIVERSITY OF CALIFORNIA (United States)

Author keywords

coefficient of thermal expansion; metal matrix composites; negative thermal expansion materials; Thermoelectrics

Indexed keywords

COEFFICIENTS OF THERMAL EXPANSIONS; ELECTRONIC DEVICE; FILLER VOLUME FRACTION; IDENTICAL CONDITIONS; INTERFACE MATERIALS; INTERFACIAL BONDING; ISOTROPIC NEGATIVE THERMAL EXPANSION; METAL MATRIX COMPOSITES; METAL PHASE; NANO POWDERS; NANO-SCALE FILLERS; NEGATIVE THERMAL EXPANSION MATERIAL; RECENT PROGRESS; SOL-GEL ROUTES; THERMALLY STABLE; THERMOELECTRICS; THERMOMECHANICAL RELIABILITY;

BUOYANCY; FILLERS; INTERFACES (MATERIALS); METALLIC MATRIX COMPOSITES; NANOCOMPOSITES; POWDER METALS; RELIABILITY; SOL-GEL PROCESS; THERMAL EXPANSION; TUNGSTEN COMPOUNDS; X RAY DIFFRACTION;

THERMAL CONDUCTIVITY;

EID: 84862206463 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-011-1856-x Document Type: Article

Times cited : (9)

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