Thermal cycling, mechanical degradation, and the effective figure of merit of a thermoelectric module

Journal of Electronic Materials

Volumn 42, Issue 3, 2013, Pages 372-381

  Barako, M T ^a   Park, W ^a   Marconnet, A M ^a   Asheghi, M ^a   Goodson, K E ^a  

^a Stanford University   (United States)

Author keywords

figure of merit; Harman method; infrared microscopy; thermal cycling; Thermoelectric module

Indexed keywords

ELECTRIC CONDUCTIVITY; SCANNING ELECTRON MICROSCOPY; THERMAL CONDUCTIVITY; THERMAL CYCLING; THERMOELECTRICITY;

FIGURE OF MERITS; HARMAN METHOD; HIGH RESOLUTION INFRARED; INFRARED MICROSCOPY; THERMO-ELECTRIC MODULES; THERMO-MECHANICAL STRESS; THERMOELECTRIC FIGURE OF MERIT; THERMOELECTRIC PERFORMANCE;

FAILURE (MECHANICAL);

EID: 84878512369     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-012-2366-1     Document Type: Article

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