Effects of interaction volume on X-ray line-scans across an ultrasonically consolidated aluminum/copper interface

Scanning

Volumn 35, Issue 5, 2013, Pages 327-335

  Mueller, Jennifer E ^a,b   Gillespie Jr , John W ^a,b   Advani, Suresh G ^a,b  

^a UNIVERSITY OF DELAWARE   (United States)

^b UNIVERSITY OF DELAWARE   (United States)

Author keywords

diffusion; interaction volume; Monte Carlo simulations; ultrasonic consolidation

Indexed keywords

ACCELERATING VOLTAGES; CONCENTRATION PROFILES; INTER-DIFFUSION COEFFICIENTS; INTERACTION VOLUME; LOW PROCESSING TEMPERATURE; THE SCANNING ELECTRON MICROSCOPES (SEM); ULTRASONIC CONSOLIDATION; X-RAY ENERGY DISPERSIVE SPECTROSCOPY;

ALUMINUM; ENERGY DISPERSIVE SPECTROSCOPY; MONTE CARLO METHODS; SCANNING ELECTRON MICROSCOPY; ULTRASONICS;

DIFFUSION;

ALUMINUM; COPPER;

ARTICLE; DIFFUSION; ELECTRON BEAM; INTERACTION VOLUME; MONTE CARLO METHOD; PRIORITY JOURNAL; SCANNING ELECTRON MICROSCOPE; SPECTROSCOPY; X RAY ENERGY DISPERSIVE SPECTROSCOPY;

EID: 84886092252     PISSN: 01610457     EISSN: 19328745     Source Type: Journal    
DOI: 10.1002/sca.21071     Document Type: Article

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