Bond formation and fiber embedment during ultrasonic consolidation

Journal of Materials Processing Technology

Volumn 209, Issue 10, 2009, Pages 4915-4924

  Yang, Y ^a   Janaki Ram, G D ^a   Stucker, B E ^a  

^a Utah State University   (United States)

Author keywords

Additive manufacturing; Bonding mechanism; Fiber embedment; Interfacial microstructures; Metal matrix composites; Ultrasonic consolidation; Ultrasonic metal welding

Indexed keywords

ADDITIVE MANUFACTURING; BONDING MECHANISM; INTERFACIAL MICROSTRUCTURES; METAL MATRIX COMPOSITES; ULTRASONIC CONSOLIDATION; ULTRASONIC METAL WELDING;

DISSIMILAR METALS; FIBERS; METAL FOIL; METALLIC MATRIX COMPOSITES; METALS; MICROSTRUCTURE; SILICON CARBIDE; WELDING;

ULTRASONICS;

EID: 67349106421     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2009.01.014     Document Type: Article

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