Microstructure evolution of 6061 O Al alloy during ultrasonic consolidation: An insight from electron backscatter diffraction

Acta Materialia

Volumn 58, Issue 7, 2010, Pages 2492-2503

  Mariani, E ^a   Ghassemieh, E ^b  

^a UNIVERSITY OF LIVERPOOL   (United Kingdom)

^b UNIVERSITY OF SHEFFIELD   (United Kingdom)

Author keywords

Aluminium alloys; Continuous dynamic recrystallization (CDRX); Electron backscatter diffraction (EBSD); Recrystallized microstructure; Ultrasonic consolidation (UC)

Indexed keywords

ALUMINIUM ALLOYS; CONTINUOUS DYNAMIC RECRYSTALLIZATION; ELECTRON BACK SCATTER DIFFRACTION; RECRYSTALLIZED MICROSTRUCTURES; ULTRASONIC CONSOLIDATION;

ALUMINUM; ALUMINUM ALLOYS; BACKSCATTERING; DEFORMATION; DYNAMIC RECRYSTALLIZATION; ELECTRON DIFFRACTION; ELECTRONS; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MICROSTRUCTURE; SILICON CARBIDE; STRAIN HARDENING; STRAIN RATE; WELDING;

ULTRASONICS;

EID: 77249156385     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2009.12.035     Document Type: Article

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