Electroless Deposition of Gold

Modern Electroplating: Fifth Edition

Volumn , Issue , 2011, Pages 483-498

  Okinaka, Yutaka ^a   Kato, Masaru ^b  

^a WASEDA UNIVERSITY   (Japan)

^b Kanto Chemical Co   (Japan)

Author keywords

Electroless deposition of gold practical problems of conventional borohydride and DMAB baths; Electroless gold, and applications in high density semiconductor packages, with semiconductor chips connected to gold plated terminals on package substrates; Improved borohydride and DMAB baths and methods of plating rate increase

Indexed keywords

EID: 84885619513     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1002/9780470602638.ch21     Document Type: Chapter

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