Electroless gold plating using L-cysteine as reducing agent & its deposition mechanism

Plating and Surface Finishing

Volumn 90, Issue 4, 2003, Pages 56-60

  Takeuchi, Takao ^a   Kohashi, Yasuhito ^a   Kim, Dong Hyun ^a   Nawafune, Hidemi ^b   Tanikubo, Masato ^b   Mizumoto, Shozo ^b  

^a Daiwa Fine Chemicals Co Ltd   (Japan)

^b KONAN UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANODIC POLARIZATION; CALORIMETRY; CHELATION; CYANIDES; ELECTROLYTIC REDUCTION; ELECTROPLATING; GOLD PLATING; POLAROGRAPHIC ANALYSIS;

CHEMICAL BATHS;

ELECTROLESS PLATING;

EID: 0037929601     PISSN: 03603164     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (8)

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3. M. Kato, K. Niikura, S. Hoshino & I. Ohno, J. Metal Fin. Soc. Japan, 42, 729 (1991).
4. Y. Shindo & H. Honma, Proc. 84rd Annual Conf. Sur. Fin. Soc. Japan, 163 (1991).
5. T. Takeuchi, Y. Kohashi, H. Nawafune, S. Mizumoto & M. Tanikubo, Proc. 98rd Annual Conf. Sur. Fin. Soc. Japan, 29 (1998).
6. T. Takeuchi, Y. Kohashi, H. Nawafune, S. Mizumoto & M. Tanikubo, Proc. 98rd Annual Conf. Sur. Fin. Soc. Japan, 31 (1998).
7. R. G. Pearson, J. Am. Chem. Soc., 85, 3555 (1963).
8. nd Ed., Tokyokagakudozin Pub., Tokyo Japan, (1961), p.50.