Electroless gold plating using erythorbic acid as reducing agent

Electrochemistry

Volumn 74, Issue 6, 2006, Pages 479-483

  Kurashina, Tadashi ^a   Nishinakayama, Hiroshi ^a   Kaneko, Norio ^b   Shinohara, Naoyuki ^b   Nawafune, Hidemi ^c  

^a Yamato Denki IndCoLtd   (Japan)

^b SHINSHU UNIVERSITY   (Japan)

^c KONAN UNIVERSITY   (Japan)

Author keywords

Autocatalytic Deposition; Electroless Au Plating; Erythorbic Acid

Indexed keywords

CATALYSIS; COMPLEXATION; ELECTROCHEMISTRY; GOLD; REACTION KINETICS;

AUTOCATALYTIC DEPOSITION; DEPOSITION RATES; ELECTROLESS AU PLATING; ERYTHORBIC ACID;

ELECTROLESS PLATING;

EID: 33746216305     PISSN: 13443542     EISSN: None     Source Type: Journal    
DOI: 10.5796/electrochemistry.74.479     Document Type: Review

References (8)

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5. T. Kurashina Y. Nozawa, N. Kaneko, N. Shinohara, and H. Nawafune, Electrochemistry, 73, 435 (2005) [in Japanese].