Electroless gold plating of 316 L stainless steel beads

Journal of the Electrochemical Society

Volumn 146, Issue 7, 1999, Pages 2517-2521

  Philippe, Lam ^a,b   Kumar, Kartik ^a   Wnek, Gary E ^b   Przybycien, Todd M ^a,c  

^a Rensselaer Polytechnic Institute   (United States)

^b Virginia Commonwealth University   (United States)

^c CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSAYS; ATOMIC FORCE MICROSCOPY; CYCLIC VOLTAMMETRY; ELECTROLESS PLATING; ELECTROPLATING SOLUTIONS; GOLD PLATING; HYDROCHLORIC ACID; PASSIVATION; SODIUM COMPOUNDS; SPECTROPHOTOMETRY; STAINLESS STEEL; TIN COMPOUNDS;

ASCORBIC ACID; SODIUM THIOSULFATE; TIN CHLORIDE;

ELECTROCHEMICAL ELECTRODES;

EID: 0344286542     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1391964     Document Type: Article

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