Electrical performance characterization of an inkjet-printed flexible circuit in a mobile application

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 3, Issue 9, 2013, Pages 1604-1610

  Koskinen, Santtu ^a   Pykäri, Lasse ^b   Mäntysalo, Matti ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

^b NOKIA RESEARCH CENTER   (United States)

Author keywords

Electrical performance; Flexible printed circuits; Inkjet technology; Nanomaterials

Indexed keywords

CONSUMER ELECTRONIC DEVICES; ELECTRICAL PERFORMANCE; FLEXIBLE CIRCUIT BOARDS; INK JET TECHNOLOGY; LARGE-SCALE MANUFACTURING; MANUFACTURING TECHNOLOGIES; STATIONARY APPLICATIONS; TESTING AND MEASUREMENTS;

CELLULAR TELEPHONES; COMPUTER APPLICATIONS; DIGITAL CONTROL SYSTEMS; ELECTROSTATIC DEVICES; ENVIRONMENTAL IMPACT; LAPTOP COMPUTERS; MANUFACTURE; MOBILE PHONES; NANOSTRUCTURED MATERIALS; PRINTED CIRCUITS; PRINTING; TECHNOLOGY; USER INTERFACES;

FLEXIBLE ELECTRONICS;

EID: 84884288234     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2013.2261774     Document Type: Article

References (25)

1. V. Pekkanen, M. Mäntysalo, K. Kaija, P. Mansikkamäki, E. Kunnari, K. Laine, J. Niittynen, S. Koskinen, E. Halonen, and U. Caglar, "Utilizing inkjet printing to fabricate electrical interconnections in a systemin-package," Microelectron. Eng., vol. 87, no. 11, pp. 2382-2390, 2010.
2. M. Mengel and I. Nikitin, "Inkjet-printed dielectrics for electronic packaging of chip embedding modules," Microelectron. Eng., vol. 87, no. 4, pp. 593-596, 2010.
3. K. Kaija, V. Pekkanen, M. Mäntysalo, S. Koskinen, J. Niittynen, E. Halonen, and P. Mansikkamäki, "Inkjetting dielectric layer for electronic applications," Microelectron. Eng., vol. 87, no. 10, pp. 1984-1991, 2010.
4. K.-J. Baeg, D. Khim, J.-H. Kim, M. Kang, I.-K. You, D.-Y. Kim, and Y.-Y. Noh, "Improved performance uniformity of inkjet-printed n-channel organic field-effect transistors and complementary inverters," Org. Electron., vol. 12, no. 4, pp. 634-640, 2011.
5. V. Pekkanen, M. Mäntysalo, and P. Mansikkamäki, "Design considerations for inkjet-printed electronic interconnections and packaging," in Proc. 40th Int. Symp. Microelectron., San Jose, CA, USA, Nov. 2007, pp. 1076-1083.
6. T. Kumpulainen, J. Pekkanen, J. Valkama, J. Laakso, R. Tuokko, and M. Mäntysalo, "Low temperature nanoparticle sintering with continuous wave and pulse lasers," Opt. Laser Technol., vol. 43, no. 3, pp. 570-576, 2011.
7. M.-K. Kim, H. Kang, K. Kang, S.-H. Lee, J. Y. Hwang, and S.-J. Moon, "Laser sintering of inkjet-printed silver lines on glass and PET substrates," Trans. Korean Soc. Mech. Eng., vol. 34, no. 11, pp. 975-982, 2010.
8. H.-S. Kim, S. R. Dhage, D.-E. Shim, and H. T. Hahn, "Intense pulsed light sintering of copper nanoink for printed electronics," Appl. Phys. A, vol. 97, no. 4, pp. 791-798, 2009.
9. J. Perelaer, M. Klokkenburg, C. E. Hendriks, and U. S. Schubert, "Microwave flash sintering of inkjet-printed silver tracks on polymer substrates," Adv. Mater., vol. 21, no. 47, pp. 4830-4834, 2009.
10. A. Denneulin, A. Blayo, C. Neuman, and J. Bras, "Infra-red assisted sintering of inkjet-printed silver tracks on paper substrates," J. Nanoparticle Res., vol. 13, no. 9, pp. 3815-3823, 2011.
11. M. L. Allen, M. Aronniemi, T. Mattila, A. Alastalo, K. Ojanperä, M. Suhonen, and H. Seppä, "Electrical sintering of nanoparticle structures," Nanotechnology, vol. 19, no. 17, pp. 175201-1-175201-4, 2008.
12. M. Hummelgård, R. Zhang, H.-E. Nilsson, and H. Olin, "Electrical sintering of silver nanoparticle ink studied by in-situ TEM probing," PLoS ONE, vol. 6, no. 2, p. e17209, 2011.
13. S. Koskinen, L. Pykäri, and M. Mäntysalo, "Inkjet-printed flexible user interface module," in Proc. Electron. Compon. Technol. Conf., San Diego, CA, USA, May-Jun. 2012, pp. 1009-1014.
14. D. Soltman and V. Subramanian, "Inkjet-printed line morphologies and temperature control of the coffee ring effect," Langmuir, vol. 24, no. 5, pp. 2224-2231, 2008.
15. 3M Novec. (2012). EGC-1700 Electronic Coating Datasheet, St. Paul, MN, USA [Online]. Available: http://solutions.3mcesko.cz/3MContentRetrievalAPI/ BlobServlet?locale =cs -CZ&lmd=1308661244000&assetId= 1273686640791&assetType =MMM-Image&blobAttribute=ImageFile
16. V. Pekkanen, M. Mäntysalo, J. Miettinen, and P. Mansikkamäki, "Novel packaging technology for combo memory package," in Proc. 16th Eur. Microelectron. Packg. Conf., Jun. 2007, pp. 235-240.
17. M. Mäntysalo and P. Mansikkamäki, "Inkjet deposited interconnections for electronic packaging," in Proc. IST Digital Fabricat., Sep. 2007, pp. 813-817.
18. Harima Chemicals Inc. (2012). Nanopaste Series Datasheet, Tokyo, Japan [Online]. Available: http://www.harima.co.jp/en/products/pdf/16-17e.pdf
19. Creative Materials. (2012). 124-08C ICA Datasheet, Ayer, MA, USA [Online]. Available: http://server.creativematerials.com/datasheets/DS- 124-08C.pdf
20. J. Niittynen, V. Pekkanen, and M. Mäntysalo, "Characterization of ICA attachment of SMD on inkjet-printed substrates," in Proc. Electron. Compon. Technol. Conf., Las Vegas, NV, USA, 2010, pp. 990-997.
21. Epotek. (2012). U300 Epoxy Datasheet, Taiwan [Online]. Available: http://www.microcure.com/pdf/Epo-Tek%20U300New.pdf
22. Loctite Hysol. (2012). PC 28 STD PCB Protective Coating Datasheet, Düsseldorf, Germany [Online]. Available at: https://tds.us.henkel.com//NA/ UT/HNAUTTDS.nsf/web/F33886225D3C200E882571870000DA9D/$File/H-PC28STD-EN. pdf
23. CTIA Test Plan. (2001). Test Plan for Mobile Station Over the Air Performance: Method of Measurement for Radiated RF Power and Receiver Performance, Washington, DC, USA [Online]. Available: http://www.ctia.org/ content/index.cfm/AID/10021
24. Digital Cellular Telecommunications System (Phase 2+); Mobile Station (MS) Conformance Specification; Part 1: Conformance Specification (3GPP TS 51.010-1 Version 4.3.0 Release 4), ETSI Standard TS 151 010-1, 2001.
25. Information Technology Equipment-Radio Disturbance Characteristics-Limits and Methods of Measurement, CISPR Standard 22/SFS-EN-55022, Nov. 1997.