Characterization of ICA attachment of SMD on inkjet-printed substrates

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 990-997

  Niittynen, Juha ^a   Pekkanen, Ville ^a   Mäntysalo, Matti ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

COMPONENT SIZE; COST-EFFICIENT; ELECTRICAL PERFORMANCE; ELECTRICALLY CONDUCTIVE ADHESIVES; END-PRODUCTS; FABRICATION PARAMETERS; FLEXIBLE PRODUCTS; FLEXIBLE SUBSTRATE; MASS PRODUCTION; PRINTABLE ELECTRONICS; PRINTED SUBSTRATE; PRODUCTION PARAMETERS; PRODUCTION TECHNOLOGY; WIRELESS SENSOR;

ELECTRIC SWITCHGEAR; ELECTRONICS INDUSTRY; FLEXIBLE ELECTRONICS; SUBSTRATES;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 77955207517     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490822     Document Type: Conference Paper

References (7)

1. Molesa, S. E., Ultra-Low-Cost Printed Electronics, Technical Report No. UCB/EECS-2006-2055, University of California at Berkley, 2006.
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3. Strauss, R. SMT Soldering handbook 2nd Edition, Newnes (Oxford, 1998), pp. 71-73
4. Miettinen, J., et al, "Inkjet printed System-in-Package design and manufacturing," Microelectronics Journal, Vol.39, Issue 12 (2008), pp. 1740-1750.
5. Mäntysalo, M., et al, "Evaluation of Inkjet Technology for Electronic Packaging and System Integration", Proc. of 57th Electronic Components and Technology Conference, Reno, Nevada, USA, May 2007, pp. 89-94.
6. Mäntysalo, M., et al, "Capability of Inkjet Technology in Electronics Manufacturing", Proc. of 59th Electronic Components and Technology Conference, San Diego, California, USA, May, 2009, pp. 1330-1336
7. Harper, C. A., Modern Plastics Handbook, McGraw-Hill (USA 2003), p. 1-51 to 1-52.