Inkjet printed dielectrics for electronic packaging of chip embedding modules

Microelectronic Engineering

Volumn 87, Issue 4, 2010, Pages 593-596

  Mengel, Manfred ^a   Nikitin, Ivan ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

Acrylate; Dielectric; Electronic; Epoxy; Ink; Inkjet; Packaging; Polyimide; Polymer; Print

Indexed keywords

ACRYLATE; ASSEMBLING PROCESS; CONDUCTIVE PATHS; CONTACT HOLES; DIELECTRIC LAYER; DIELECTRIC STRENGTHS; ELECTRONIC; ELECTRONIC PACKAGING; HIGH THERMAL STABILITY; INK-JET PRINTING; LAYER THICKNESS; POLYIMIDE POLYMERS; WIRE BONDS;

DIELECTRIC MATERIALS; INK; PACKAGING; POLYIMIDES; PRINTING; SEMICONDUCTOR DEVICE MANUFACTURE;

CHIP SCALE PACKAGES;

EID: 75149154589     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2009.08.033     Document Type: Article

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