Nano-analysis of grain boundary and triple junction transport in nanocrystalline Ni/Cu

Ultramicroscopy

Volumn 132, Issue , 2013, Pages 164-170

  Reda Chellali, Mohammed ^a,b   Balogh, Zoltan ^a   Schmitz, Guido ^a  

^a UNIVERSITY OF MÜNSTER   (Germany)

^b UNIVERSITY OF ORAN   (Algeria)

Author keywords

Atom probe tomography; Copper; Grain boundary; Nanocrystalline metals; Nickel; Triple junctions

Indexed keywords

ATOM PROBE TOMOGRAPHY; GRAIN BOUNDARY TOPOLOGY; GRAIN BOUNDARY WIDTHS; HIGH ANGLE GRAIN BOUNDARIES; NANOCRYSTALLINE METAL; TRIPLE JUNCTION; TRIPLE JUNCTION TRANSPORTS; TRIPLE JUNCTIONS AND GRAIN BOUNDARIES;

ACTIVATION ENERGY; COPPER; GRAIN GROWTH; NANOCRYSTALLINE MATERIALS; NICKEL;

GRAIN BOUNDARIES;

COPPER; NANOCRYSTAL; NICKEL;

ARTICLE; ATOM PROBE TOMOGRAPHY; DIFFUSION; ELECTRON MICROSCOPY; GRAIN; GRAIN (STRUCTURE); NANOANALYSIS; TEMPERATURE DEPENDENCE; TOMOGRAPHY; TRIPLE JUNCTION;

EID: 84883800210     PISSN: 03043991     EISSN: 18792723     Source Type: Journal    
DOI: 10.1016/j.ultramic.2012.12.002     Document Type: Article

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