Cu salt ink formulation for printed electronics using photonic sintering

Langmuir

Volumn 29, Issue 35, 2013, Pages 11192-11197

  Araki, Teppei ^a   Sugahara, Tohru ^a   Jiu, Jinting ^a   Nagao, Shijo ^a   Nogi, Masaya ^a   Koga, Hirotaka ^a   Uchida, Hiroshi ^b   Shinozaki, Kenji ^b   Suganuma, Katsuaki ^a  

^a OSAKA UNIVERSITY   (Japan)

^b High Performance Materials Department   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHAIN LENGTH; COPPER COMPOUNDS; GAS EMISSIONS; LIGANDS; LIGHT ABSORPTION; MORPHOLOGY; SURFACE MORPHOLOGY; WIRE;

ABSORBANCE COEFFICIENTS; ABSORBANCE PROPERTIES; ABSORPTION ABILITIES; CARBON-CHAIN LENGTH; CRYSTAL-FIELD SPLITTING; ELECTRICAL CONDUCTIVITY; ELECTRONIC CONDUCTION; PRINTED ELECTRONICS;

SINTERING;

EID: 84883481025     PISSN: 07437463     EISSN: 15205827     Source Type: Journal    
DOI: 10.1021/la402026r     Document Type: Article

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